| Patent | Date |
|---|
Forming method of hard mask
Grant 11,004,684 - Iwashita , et al. May 11, 2 | 2021-05-11 |
Plating Method, Plating Apparatus And Recording Medium
App 20210115565 - Inatomi; Yuichiro ; et al. | 2021-04-22 |
Plating Method, Plating System, And Recording Medium
App 20210108316 - Mizutani; Nobutaka ; et al. | 2021-04-15 |
Plating Method And Recording Medium
App 20200325581 - Iwai; Kazutoshi ; et al. | 2020-10-15 |
Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium
Grant 10,755,973 - Fujita , et al. A | 2020-08-25 |
Plating apparatus, plating method, and recording medium
Grant 10,731,256 - Iwai , et al. | 2020-08-04 |
Metal Wiring Layer Forming Method, Metal Wiring Layer Forming Apparatus And Recording Medium
App 20190229016 - Fujita; Keiichi ; et al. | 2019-07-25 |
Forming Method Of Hard Mask
App 20190157083 - Iwashita; Mitsuaki ; et al. | 2019-05-23 |
Forming method of hard mask, forming apparatus of hard mask and recording medium
Grant 10,224,202 - Iwashita , et al. | 2019-03-05 |
Plating method and recording medium
Grant 10,224,208 - Mizutani , et al. | 2019-03-05 |
Plating method, plated component, and plating system
Grant 10,179,950 - Inatomi , et al. Ja | 2019-01-15 |
Plating method, plating apparatus, and storage medium
Grant 10,138,556 - Mizutani , et al. Nov | 2018-11-27 |
Plating method, plating system and storage medium
Grant 10,030,308 - Tanaka , et al. July 24, 2 | 2018-07-24 |
Catalyst layer forming method, catalyst layer forming system and recording medium
Grant 9,966,306 - Inatomi , et al. May 8, 2 | 2018-05-08 |
Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure
Grant 9,888,585 - Shinguhara , et al. February 6, 2 | 2018-02-06 |
Plating method, plating system and storage medium
Grant 9,837,308 - Mizutani , et al. December 5, 2 | 2017-12-05 |
Plating Apparatus, Plating Method, And Recording Medium
App 20170292192 - Iwai; Kazutoshi ; et al. | 2017-10-12 |
Forming Method Of Hard Mask, Forming Apparatus Of Hard Mask And Recording Medium
App 20170287713 - Iwashita; Mitsuaki ; et al. | 2017-10-05 |
Plating method, plating apparatus and storage medium
Grant 9,725,810 - Mizutani , et al. August 8, 2 | 2017-08-08 |
Plating method, recording medium and plating system
Grant 9,711,363 - Mizutani , et al. July 18, 2 | 2017-07-18 |
Pre-treatment method for plating and storage medium
Grant 9,653,350 - Tanaka , et al. May 16, 2 | 2017-05-16 |
Pre-treatment method of plating, storage medium, and plating system
Grant 9,650,717 - Iwai , et al. May 16, 2 | 2017-05-16 |
Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium
Grant 9,653,354 - Tanaka , et al. May 16, 2 | 2017-05-16 |
Plating Apparatus, Plating Method And Recording Medium
App 20170121822 - Mizutani; Nobutaka ; et al. | 2017-05-04 |
Substrate Processing Apparatus, Substrate Processing Method And Recording Medium
App 20170084480 - Mizutani; Nobutaka ; et al. | 2017-03-23 |
Plating apparatus, plating method, and storage medium
Grant 9,552,994 - Inatomi , et al. January 24, 2 | 2017-01-24 |
Plating Method, Plated Component, And Plating System
App 20160372367 - Inatomi; Yuichiro ; et al. | 2016-12-22 |
Plating Method And Recording Medium
App 20160336179 - Mizutani; Nobutaka ; et al. | 2016-11-17 |
Plating Method, Recording Medium And Plating System
App 20160307759 - Mizutani; Nobutaka ; et al. | 2016-10-20 |
Catalyst Layer Forming Method, Catalyst Layer Forming System And Recording Medium
App 20160247683 - Inatomi; Yuichiro ; et al. | 2016-08-25 |
Semiconductor Device, Plating Method, Plating System And Recording Medium
App 20160247765 - Inatomi; Yuichiro ; et al. | 2016-08-25 |
Metal Wiring Layer Forming Method, Metal Wiring Layer Forming Apparatus, And Recording Medium
App 20160240436 - Tanaka; Takashi ; et al. | 2016-08-18 |
Method For Manufacturing Wiring Structure, Copper Displacement Plating Solution, And Wiring Structure
App 20160095228 - Shinguhara; Shoso ; et al. | 2016-03-31 |
Pre-treatment Method Of Plating, Storage Medium, And Plating System
App 20150247242 - Iwai; Kazutoshi ; et al. | 2015-09-03 |
Electroless Plating Method, Electroless Plating Apparatus And Storage Medium
App 20150218702 - Mizutani; Nobutaka ; et al. | 2015-08-06 |
Plating Apparatus, Plating Method, And Storage Medium
App 20150167174 - Mizutani; Nobutaka ; et al. | 2015-06-18 |
Plating Method, Plating Apparatus, And Storage Medium
App 20150147476 - Mizutani; Nobutaka ; et al. | 2015-05-28 |
Pre-treatment Method For Plating And Storage Medium
App 20150140816 - Tanaka; Takashi ; et al. | 2015-05-21 |
Plating Apparatus, Plating Method, And Storage Medium
App 20150099355 - Inatomi; Yuichiro ; et al. | 2015-04-09 |
Plating Method, Plating System And Storage Medium
App 20150079785 - Mizutani; Nobutaka ; et al. | 2015-03-19 |
Plating Method, Plating System And Storage Medium
App 20150030774 - Tanaka; Takashi ; et al. | 2015-01-29 |
Liquid processing method, liquid processing apparatus and recording medium
Grant 8,741,070 - Mizutani , et al. June 3, 2 | 2014-06-03 |
Plating Method, Plating Apparatus And Storage Medium
App 20140127410 - Mizutani; Nobutaka ; et al. | 2014-05-08 |
Liquid Processing Method, Liquid Processing Apparatus and Recording Medium
App 20120160273 - MIZUTANI; Nobutaka ; et al. | 2012-06-28 |
Chemical Solution Or Pure Water Feeder, Substrate Processing System, Substrate Processing Apparatus, Or Substrate Processing Method
App 20090107521 - Ohmi; Tadahiro ; et al. | 2009-04-30 |
Method of manufacturing trench structure for device
App 20070148985 - Mizutani; Nobutaka ; et al. | 2007-06-28 |
Method of manufacturing trench structure for device
Grant 7,176,142 - Mizutani , et al. February 13, 2 | 2007-02-13 |
Method of manufacturing trench structure for device
App 20040002214 - Mizutani, Nobutaka ; et al. | 2004-01-01 |
| 