loadpatents
Patent applications and USPTO patent grants for Mizuta; Kei.The latest application filed is for "lighting apparatus".
Patent | Date |
---|---|
Heat sink package and method of manufacturing Grant 8,988,882 - Ohsawa , et al. March 24, 2 | 2015-03-24 |
Heat sink, cooling module and coolable electronic board Grant 8,982,559 - Ohsawa , et al. March 17, 2 | 2015-03-17 |
Lighting Apparatus App 20140184050 - MIZUTA; Kei | 2014-07-03 |
Heat pipe and circuit board with a heat pipe function Grant 8,611,089 - Mizuta , et al. December 17, 2 | 2013-12-17 |
Heat Sink Package And Method Of Manufacturing App 20120127667 - Ohsawa; Kenji ;   et al. | 2012-05-24 |
Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Board With A Heat Pipe Function App 20120106084 - Mizuta; Kei ;   et al. | 2012-05-03 |
Heat Pipe And Electronic Device App 20110308772 - Tsuruta; Katsuya ;   et al. | 2011-12-22 |
Heat Sink, Cooling Module And Coolable Electronic Board App 20110214904 - Ohsawa; Kenji ;   et al. | 2011-09-08 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.