Mizushima; Etsuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mizushima; Etsuo.The latest application filed is for "resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring boar".

Company Profile

4.8.10

Mizushima; Etsuo - Tokyo JP
MIZUSHIMA; Etsuo - Chiyoda-ku Tokyo
Mizushima; Etsuo - Chikusei N/A JP
Mizushima; Etsuo - Chikusei-shi JP
Mizushima; Etsuo - Yuki JP
Mizushima; Etsuo - Yuki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board Grant 11,339,251 - Nagai , et al. May 24, 2	2022-05-24
Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar Grant 11,286,346 - Tanigawa , et al. March 29, 2	2022-03-29
Multilayer transmission line plate Grant 10,957,964 - Tanigawa , et al. March 23, 2	2021-03-23
Multilayer transmission line plate Grant 10,506,705 - Kondou , et al. Dec	2019-12-10
Resin Composition, Resin Film, Laminate, Multilayer Printed Wiring Board And Method For Producing Multilayer Printed Wiring Boar App 20190309130 - NAGAI; Yuki ; et al.	2019-10-10
Multilayer Transmission Line Plate App 20190023899 - TANIGAWA; Takao ; et al.	2019-01-24
Multilayer Transmission Line Plate App 20180139837 - KONDOU; Yuusuke ; et al.	2018-05-17
Resin Composition, Support With Resin Layer, Prepreg, Laminate, Multilayered Printed Wiring Board, And Printed Wiring Board For Millimeter-wave Radar App 20180002485 - TANIGAWA; Takao ; et al.	2018-01-04
Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plate Grant 9,397,381 - Kondou , et al. July 19, 2	2016-07-19
Electromagnetic Coupling Structure, Multilayered Transmission Line Plate, Method For Producing Electromagnetic Coupling Structure, And Method For Producing Multilayered Transmission Line Plate App 20130328646 - Kondou; Yuusuke ; et al.	2013-12-12
Electromagnetic Field Coupling Structure, Multi-layer Transmission-line Plate, Method Of Manufacturing Electromagnetic Field Coupling Structure, And Method Of Manufacturing Multi-layer Transmission-line Plate App 20130057365 - Mizushima; Etsuo ; et al.	2013-03-07
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device Grant 7,592,250 - Shimada , et al. September 22, 2	2009-09-22
Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device Grant 7,239,013 - Shimada , et al. July 3, 2	2007-07-03
Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device App 20070108588 - Shimada; Yasushi ; et al.	2007-05-17
Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device App 20060063367 - Shimada; Yasushi ; et al.	2006-03-23

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