MIZUSHIMA; Aya
Patent Applications and Registrations
Patent applications and USPTO patent grants for MIZUSHIMA; Aya.The latest application filed is for "epoxy resin composition for electronic parts encapsulation and electronic parts-equipped device using the same".
- MIZUSHIMA; Aya - Osaka JP
| Patent | Date |
|---|---|
| Epoxy Resin Composition For Electronic Parts Encapsulation And Electronic Parts-equipped Device Using The Same App 20130148304 - KITAGAWA; Yuya ; et al. | 2013-06-13 |
| Epoxy Resin Composition For Electronic Component Encapsulation And Electronic Component Device Using The Same App 20130012619 - KITAGAWA; Yuya ; et al. | 2013-01-10 |
| Production method of suspension board with circuit Grant 8,236,186 - Mizushima , et al. August 7, 2 | 2012-08-07 |
| Wired circuit board and producing method thereof Grant 7,982,136 - Mizushima , et al. July 19, 2 | 2011-07-19 |
| Production Method of Suspension Board with Circuit App 20090261060 - Mizushima; Aya ; et al. | 2009-10-22 |
| Suspension Board with Circuit and Production Method Thereof App 20090255717 - Mizushima; Aya ; et al. | 2009-10-15 |
| Wired circuit board and producing method thereof App 20080277147 - Mizushima; Aya ; et al. | 2008-11-13 |
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