Mizuoka; Seiji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mizuoka; Seiji.The latest application filed is for "component mounting body manufacturing system and component mounting body manufacturing method".

Company Profile

3.10.4

Mizuoka; Seiji - Fukuoka JP
Mizuoka; Seiji - Yamanashi-ken JP
Mizuoka; Seiji - Osaka-fu JP
Mizuoka; Seiji - Moriguchi JP
Mizuoka; Seiji - Katano JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component mounting body manufacturing system and component mounting body manufacturing method Grant 10,821,468 - Isobata , et al. November 3, 2	2020-11-03
Flux recovery device, and reflow apparatus and gas exchange method using the same Grant 10,695,713 - Mizuoka , et al.	2020-06-30
Component mounted body manufacturing system and component mounted body manufacturing method Grant 10,661,401 - Mizuoka , et al.	2020-05-26
Component Mounting Body Manufacturing System And Component Mounting Body Manufacturing Method App 20180272378 - ISOBATA; YOSHINORI ; et al.	2018-09-27
Component Mounted Body Manufacturing System And Component Mounted Body Manufacturing Method App 20180243869 - MIZUOKA; SEIJI ; et al.	2018-08-30
Flux Recovery Device, And Reflow Apparatus And Gas Exchange Method Using The Same App 20180214819 - MIZUOKA; SEIJI ; et al.	2018-08-02
Connection inspecting apparatus, connection inspecting method, and recording medium for recording programs executing the method Grant 6,872,949 - Mizuoka , et al. March 29, 2	2005-03-29
Connection inspecting apparatus, connection inspecting method, and recording medium for recording programs executing the method App 20010040217 - Mizuoka, Seiji ; et al.	2001-11-15
Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component Grant 6,167,149 - Tsujikawa , et al. December 26, 2	2000-12-26
Inspecting apparatus of mounted component Grant 5,724,439 - Mizuoka , et al. March 3, 1	1998-03-03
Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component Grant 5,555,316 - Tsujikawa , et al. September 10, 1	1996-09-10
Method of detecting the position of an object pattern in an image Grant 5,226,095 - Okumura , et al. July 6, 1	1993-07-06
Position recognizing method and apparatus therefor Grant 5,136,661 - Kobayasi , et al. August 4, 1	1992-08-04
Lead's position recognizing device Grant 5,007,097 - Mizuoka , et al. April 9, 1	1991-04-09

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