Mizunoya; Nobuyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mizunoya; Nobuyuki.The latest application filed is for "ceramic circuit board with a metal plate projected to prevent solder-flow".

Company Profile

0.18.0

Mizunoya; Nobuyuki - Yokohama JP
Mizunoya; Nobuyuki - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ceramic circuit board with a metal plate projected to prevent solder-flow Grant 6,284,985 - Naba , et al. September 4, 2	2001-09-04
Silicon nitride circuit board Grant 6,040,039 - Ikeda , et al. March 21, 2	2000-03-21
Silicon nitride circuit board Grant 5,998,000 - Ikeda , et al. December 7, 1	1999-12-07
High thermal conductive silicon nitride sintered body, method of producing the same and press-contacted body Grant 5,744,410 - Komatsu , et al. April 28, 1	1998-04-28
Ceramic circuit board with a curved lead terminal Grant 5,328,751 - Komorita , et al. July 12, 1	1994-07-12
Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it Grant 5,063,121 - Sato , et al. November 5, 1	1991-11-05
Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof Grant 4,959,507 - Tanaka , et al. September 25, 1	1990-09-25
Aluminum nitride circuit board Grant 4,906,511 - Sato , et al. March 6, 1	1990-03-06
Electronic apparatus having semiconductor device Grant 4,901,137 - Sato , et al. February 13, 1	1990-02-13
Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it Grant 4,883,704 - Sato , et al. November 28, 1	1989-11-28
Method for directly bonding ceramic and metal members and laminated body of the same Grant 4,849,292 - Mizunoya , et al. July 18, 1	1989-07-18
Composite alumina-aluminum nitride circuit substrate Grant 4,835,065 - Sato , et al. May 30, 1	1989-05-30
Aluminum nitride sintered body having conductive metallized layer Grant 4,770,953 - Horiguchi , et al. September 13, 1	1988-09-13
Aluminum nitride substrate Grant 4,761,345 - Sato , et al. August 2, 1	1988-08-02
Substrate structure Grant 4,704,320 - Mizunoya , et al. November 3, 1	1987-11-03
Method for directly bonding ceramic and metal members and laminated body of the same Grant 4,693,409 - Mizunoya , et al. September 15, 1	1987-09-15
Ceramic bonded structure and method of manufacturing the same Grant 4,542,073 - Tanaka , et al. September 17, 1	1985-09-17
Substrate for semiconductor modules and method of manufacture Grant 4,540,462 - Mizunoya , et al. September 10, 1	1985-09-10

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