Mizuno; Yoko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mizuno; Yoko.The latest application filed is for "barrel plating or high-speed rotary plating using a neutral tin plating solution".
- Mizuno; Yoko - Shibata-shi JP
- Mizuno; Yoko - Shibata JP
- Mizuno; Yoko - Niigata JP
| Patent | Date |
|---|---|
| Barrel Plating Or High-speed Rotary Plating Using A Neutral Tin Plating Solution App 20180135195 - Kondo; Makoto ; et al. | 2018-05-17 |
| Surface treatment solutions for gold and gold alloys Grant 9,914,838 - Mizuno , et al. March 13, 2 | 2018-03-13 |
| Surface Treatment Solutions For Gold And Gold Alloys App 20170002211 - Mizuno; Yoko ; et al. | 2017-01-05 |
| Electrolytic Copper Plating Solution App 20160186348 - Mizuno; Yoko ; et al. | 2016-06-30 |
| Electrolytic copper plating solution and method of electrolytic copper plating Grant 9,169,576 - Saito , et al. October 27, 2 | 2015-10-27 |
| Electrolytic copper plating liquid and the electrolytic copper plating method Grant 9,150,976 - Saito , et al. October 6, 2 | 2015-10-06 |
| Electrolytic Copper Plating Liquid And The Electrolytic Copper Plating Method App 20140097087 - SAITO; Mutsuko ; et al. | 2014-04-10 |
| Electrolytic Copper Plating Solution And Method Of Electrolytic Copper Plating App 20130319867 - SAITO; Mutsuko ; et al. | 2013-12-05 |
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