Mizuno; Yasuyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mizuno; Yasuyuki.The latest application filed is for "thermosetting resin composition, prepreg, laminate and multilayer printed wiring board".

Company Profile

5.20.25

Mizuno; Yasuyuki - Tokyo JP
MIZUNO; Yasuyuki - Chiyoda-ku Tokyo
Mizuno; Yasuyuki - Chikusei JP
Mizuno; Yasuyuki - Chikusei-shi JP
Mizuno; Yasuyuki - Ibaraki N/A JP
Mizuno; Yasuyuki - Shimodate JP
Mizuno, Yasuyuki - Shimodate-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interlayer insulating film and method for producing same Grant 11,432,400 - Matsuura , et al. August 30, 2	2022-08-30
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board Grant 11,359,055 - Tanigawa , et al. June 14, 2	2022-06-14
Resin composition, prepreg, laminate and multilayer printed wiring board Grant 11,041,045 - Nagai , et al. June 22, 2	2021-06-22
Thermosetting Resin Composition, Prepreg, Laminate And Multilayer Printed Wiring Board App 20200071464 - TANIGAWA; Takao ; et al.	2020-03-05
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board Grant 10,519,279 - Tanigawa , et al. Dec	2019-12-31
Adhesive Film For Multilayer Printed-wiring Board App 20190230790 - KASAHARA; Aya ; et al.	2019-07-25
Interlayer Insulating Film And Method For Producing Same App 20190182953 - MATSUURA; Masaharu ; et al.	2019-06-13
Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board Grant 10,251,265 - Kawaguchi , et al.	2019-04-02
Interlayer Insulating Resin Film, Interlayer Insulating Resin Film Having Adhesive Auxiliary Layer, And Printed Circuit Board App 20180171135 - KASAHARA; Aya ; et al.	2018-06-21
Resin Composition, Prepreg, Laminate And Multilayer Printed Wiring Board App 20180134842 - NAGAI; Yuki ; et al.	2018-05-17
Thermosetting Resin Composition, Prepreg, Laminate And Multilayer Printed Wiring Board App 20180127547 - TANIGAWA; Takao ; et al.	2018-05-10
Pregreg, Film With Resin, Metal Foil With Resin, Metal-clad Laminate, And Printed Wiring Board App 20180098425 - Kawaguchi; Akiko ; et al.	2018-04-05
Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same Grant 9,828,466 - Mizuno , et al. November 28, 2	2017-11-28
Polyphenylene Ether Derivative Having N-substituted Maleimide Group, And Heat Curable Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate, And Multilayer Printed Wiring Board Using Same App 20170051109 - MIZUNO; Yasuyuki ; et al.	2017-02-23
Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plate Grant 9,397,381 - Kondou , et al. July 19, 2	2016-07-19
Electromagnetic Coupling Structure, Multilayered Transmission Line Plate, Method For Producing Electromagnetic Coupling Structure, And Method For Producing Multilayered Transmission Line Plate App 20130328646 - Kondou; Yuusuke ; et al.	2013-12-12
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same Grant 8,568,891 - Mizuno , et al. October 29, 2	2013-10-29
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same Grant 8,501,870 - Mizuno , et al. August 6, 2	2013-08-06
Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate Grant 8,404,769 - Fujimoto , et al. March 26, 2	2013-03-26
Electromagnetic Field Coupling Structure, Multi-layer Transmission-line Plate, Method Of Manufacturing Electromagnetic Field Coupling Structure, And Method Of Manufacturing Multi-layer Transmission-line Plate App 20130057365 - Mizushima; Etsuo ; et al.	2013-03-07
Process For Producing Resin Varnish Containing Semi-ipn Composite, Thermosetting Resin And, Provided Using The Same, Resin Varnish For Printed Wiring Board, Prepreg And Metal-clad Laminate App 20130040153 - FUJIMOTO; Daisuke ; et al.	2013-02-14
Thermosetting Resin Composition Of Semi-ipn Composite, And Varnish, Prepreg And Metal Clad Laminated Board Using The Same App 20130000843 - MIZUNO; Yasuyuki ; et al.	2013-01-03
Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same Grant 8,277,948 - Mizuno , et al. October 2, 2	2012-10-02
Thermosetting Resin Composition Of Semi-ipn Composite, And Varnish, Prepreg And Metal Clad Laminated Board Using The Same App 20120214009 - MIZUNO; Yasuyuki ; et al.	2012-08-23
Pregreg, Film With Resin, Metal Foil With Resin, Metal-clad Laminate, And Printed Wiring Board App 20110272185 - Kawaguchi; Akiko ; et al.	2011-11-10
Composition of polycyanate ester and biphenyl epoxy resin Grant 7,816,430 - Mizuno , et al. October 19, 2	2010-10-19
Thermosetting Resin Composition of Semi-IPN Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same App 20100233495 - Mizuno; Yasuyuki ; et al.	2010-09-16
Process For Producing Resin Varnish Containing Semi-ipn Composite Thermosetting Resin And, Provided Using The Same, Resin Varnish For Printed Wiring Board, Prepreg And Metal-clad Laminate App 20100129676 - Fujimoto; Daisuke ; et al.	2010-05-27
Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board App 20090323300 - Fujimoto; Daisuke ; et al.	2009-12-31
Resin composition excellent in dielectric properties, process for producing the same, varnish produced using the same, process for producing the varnish, and prepreg and metal-clad laminate using the resin composition and varnish App 20070207326 - Mizuno; Yasuyuki ; et al.	2007-09-06
Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate Grant 7,157,506 - Mizuno , et al. January 2, 2	2007-01-02
Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using the same App 20060167189 - Mizuno; Yasuyuki ; et al.	2006-07-27
Thermosetting resin composition and use thereof Grant 7,078,106 - Tsuchikawa , et al. July 18, 2	2006-07-18
Thermosetting resin composition and use thereof App 20040091726 - Tsuchikawa, Shinji ; et al.	2004-05-13
Thermosetting resin composition and use thereof Grant 6,667,107 - Tsuchikawa , et al. December 23, 2	2003-12-23
Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate App 20030130412 - Mizuno, Yasuyuki ; et al.	2003-07-10
Thermosetting resin composition and use thereof App 20020147277 - Tsuchikawa, Shinji ; et al.	2002-10-10
Decorative laminated sheet having a feeling of coating and a process for producing same Grant 5,413,840 - Mizuno May 9, 1	1995-05-09

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