Mizuno; Katsumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mizuno; Katsumi.The latest application filed is for "thermosetting epoxy resin composition, circut board laminate, metal-based circut board, and power module".
- Mizuno; Katsumi - Yokohama-shi JP
- Mizuno; Katsumi - Yokohama N/A JP
- Mizuno; Katsumi - Chiba N/A JP
- Mizuno; Katsumi - Tokyo JA
| Patent | Date |
|---|---|
| Thermosetting Epoxy Resin Composition, Circut Board Laminate, Metal-based Circut Board, And Power Module App 20210403702 - Mizuno; Katsumi ; et al. | 2021-12-30 |
| Method Of Manufacturing A Circuit Board Laminate App 20190037692 - MIZUNO; Katsumi ; et al. | 2019-01-31 |
| Metal Base Circuit Board And Method Of Manufacturing The Metal Base Circuit Board App 20170332488 - MIZUNO; Katsumi ; et al. | 2017-11-16 |
| Circuit board laminate and metal-based circuit board Grant 9,357,642 - Mizuno , et al. May 31, 2 | 2016-05-31 |
| Circuit Board Laminate, Metal Base Circuit Board And Power Module App 20150118509 - MIZUNO; Katsumi ; et al. | 2015-04-30 |
| Nipple covering member and breast pump Grant 8,992,467 - Kobayashi , et al. March 31, 2 | 2015-03-31 |
| Circuit Board Laminate And Metal-based Circuit Board App 20130081865 - MIZUNO; Katsumi ; et al. | 2013-04-04 |
| Nipple Covering Member And Breast Pump App 20100130921 - Kobayashi; Hiroshi ; et al. | 2010-05-27 |
| Offset Printing Machine Grant 3,858,508 - Kaneko , et al. * January 7, 1 | 1975-01-07 |
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