Mizunashi; Harumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mizunashi; Harumi.The latest application filed is for "heat sink, semiconductor device, and method of manufacturing heat sink".
- Mizunashi; Harumi - Kanagawa JP
- Mizunashi, Harumi - Tokyo JP
- Mizunashi; Harumi - Minato JP
| Patent | Date |
|---|---|
| Heat sink, semiconductor device, and method of manufacturing heat sink Grant 8,077,466 - Mizunashi December 13, 2 | 2011-12-13 |
| Heat sink, semiconductor device, and method of manufacturing heat sink App 20110044007 - Mizunashi; Harumi | 2011-02-24 |
| Semiconductor Device App 20080142953 - MIZUNASHI; Harumi | 2008-06-19 |
| Semiconductor device having solder bumps and method for manufacturing same App 20030001262 - Mizunashi, Harumi | 2003-01-02 |
| Semiconductor device and process for fabricating the same App 20020139571 - Mizunashi, Harumi | 2002-10-03 |
| Multilayer printed circuit board having latticed films on an interconnection layer Grant 5,736,234 - Mizunashi April 7, 1 | 1998-04-07 |
| Heat-radiating fin for a heat sink Grant D348,252 - Mizunashi , et al. June 28, 1 | 1994-06-28 |
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