Miyoshi; Masayuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyoshi; Masayuki.The latest application filed is for "epoxy resin composition, fiber reinforced material, molded article, and pressure vessel".

Company Profile

4.13.12

Miyoshi; Masayuki - Ehime JP
Miyoshi; Masayuki - Iyo-gun Ehime
Miyoshi; Masayuki - lyo-gun Ehime
Miyoshi, Masayuki - Yokohama JP
Miyoshi; Masayuki - Hadano JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Epoxy resin composition, prepreg, and fiber-reinforced composite material Grant 11,345,808 - Takahashi , et al. May 31, 2	2022-05-31
Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel Grant 11,186,692 - Mori , et al. November 30, 2	2021-11-30
Epoxy resin composition, fiber reinforced composite material, molded article and pressure vessel Grant 11,186,691 - Mori , et al. November 30, 2	2021-11-30
Epoxy Resin Composition, Fiber Reinforced Material, Molded Article, And Pressure Vessel App 20210198417 - Mori; Ayumi ; et al.	2021-07-01
Epoxy Resin Composition, Fiber Reinforced Composite Material, Molded Article And Pressure Vessel App 20200239649 - Mori; Ayumi ; et al.	2020-07-30
Epoxy Resin Composition, Fiber Reinforced Composite Material, Molded Article And Pressure Vessel App 20200239648 - Mori; Ayumi ; et al.	2020-07-30
Epoxy resin composition, fiber reinforced composite material, molded article, and pressure vessel Grant 10,696,805 - Mori , et al. June 30, 2	2020-06-30
Epoxy Resin Composition, Prepreg, And Fiber-reinforced Composite Material App 20200140676 - Takahashi; Eiki ; et al.	2020-05-07
Epoxy resin composition, fiber-reinforced composite material, and method for producing the same Grant 10,538,637 - Kamae , et al. Ja	2020-01-21
Epoxy resin composition and fiber reinforced composite material Grant 10,253,142 - Matsuda , et al.	2019-04-09
Epoxy Resin Composition, Fiber Reinforced Composite Material, Molded Article, And Pressure Vessel App 20180186946 - Mori; Ayumi ; et al.	2018-07-05
Epoxy Resin Composition And Fiber Reinforced Composite Material App 20170327652 - Matsuda; Ayumi ; et al.	2017-11-16
Epoxy Resin Composition, Fiber-reinforced Composite Material, And Method For Producing The Same App 20160159993 - KAMAE; Toshiya ; et al.	2016-06-09
Binder composition, reinforcing-fiber base material, preform, fiber-reinforced composite material, and manufacturing method therefor Grant 9,062,203 - Kochi , et al. June 23, 2	2015-06-23
Binder Composition, Reinforcing-fiber Base Material, Preform, Fiber-reinforced Composite Material, And Manufacturing Method Therefor App 20120178329 - Kochi; Shinji ; et al.	2012-07-12
Epoxy Resin Composition, Fiber-reinforced Composite Material, And Method For Producing The Same App 20110097568 - Kamae; Toshiya ; et al.	2011-04-28
Temperature compensating circuit, temperature compensating logarithm conversion circuit and light receiver App 20040004179 - Hayami, Akihiro ; et al.	2004-01-08
Temperature compensating circuit, temperature compensating logarithm conversion circuit and light receiver Grant 6,603,110 - Hayami , et al. August 5, 2	2003-08-05
Temperature compensating circuit, temperature compensating logarithm conversion circuit and light receiver App 20030029991 - Hayami, Akihiro ; et al.	2003-02-13
Circuit simulation method with clock event suppression for debugging LSI circuits Grant 4,899,273 - Omoda , et al. February 6, 1	1990-02-06
Method for generating logic circuit data Grant 4,758,953 - Morita , et al. July 19, 1	1988-07-19
Method of digital logic simulation Grant 4,342,093 - Miyoshi July 27, 1	1982-07-27

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