Miyoshi; Kei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyoshi; Kei.The latest application filed is for "silicone adhesive for semiconductor element".

Company Profile

0.18.23

Miyoshi; Kei - Niigata N/A JP
Miyoshi; Kei - Annaka JP
Miyoshi; Kei - Annaka-shi JP
Miyoshi; Kei - Gunma-ken JP
Miyoshi, Kei - Usui-gun JP
Miyoshi; Kei - Matsuida JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing high purity terminal olefin compound Grant 8,609,886 - Miyoshi , et al. December 17, 2	2013-12-17
Silicone adhesive for semiconductor element Grant 8,592,030 - Yamakawa , et al. November 26, 2	2013-11-26
Silicone Adhesive For Semiconductor Element App 20130146939 - YAMAKAWA; Naoki ; et al.	2013-06-13
Heat-conductive silicone composition and cured product thereof Grant 8,119,758 - Sakurai , et al. February 21, 2	2012-02-21
Method For Producing High Purity Terminal Olefin Compound App 20120029229 - Miyoshi; Kei ; et al.	2012-02-02
Heat conductive silicone grease compositions Grant 8,017,684 - Endo , et al. September 13, 2	2011-09-13
Silicone resin composition for die bonding Grant 7,951,891 - Miyoshi , et al. May 31, 2	2011-05-31
Silicone-sealed LED Grant 7,838,117 - Miyoshi , et al. November 23, 2	2010-11-23
Heat dissipating silicone grease compositions Grant 7,786,056 - Matsumoto , et al. August 31, 2	2010-08-31
Addition curable silicon resin composition for light emitting diode Grant 7,705,104 - Yamakawa , et al. April 27, 2	2010-04-27
Addition curing silicone composition capable of producing a cured product with excellent crack resistance Grant 7,615,387 - Miyoshi November 10, 2	2009-11-10
Silicone Adhesive For Semiconductor Element App 20090258216 - YAMAKAWA; Naoki ; et al.	2009-10-15
LED devices and silicone resin composition therefor Grant 7,595,113 - Miyoshi September 29, 2	2009-09-29
Heat conductive silicone rubber composition and molded article Grant 7,547,743 - Goto , et al. June 16, 2	2009-06-16
Heat Dissipating Silicone Grease Compositions App 20080269084 - Matsumoto; Nobuaki ; et al.	2008-10-30
Method for adhering a thermally-conductive silicone composition, a primer for adhering a thermally-conductive silicone composition and a method for manufacturing a bonded complex of a thermally-conductive silicone composition App 20080260957 - Yamada; Kunihiro ; et al.	2008-10-23
Heat Conductive Silicone Grease Composition And Cured Product Thereof App 20080213578 - Endo; Akihiro ; et al.	2008-09-04
Method for sealing microcomponent App 20080099139 - Miyoshi; Kei ; et al.	2008-05-01
Heat-conductive Silicone Composition And Cured Product Thereof App 20080057325 - Sakurai; Ikuo ; et al.	2008-03-06
Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device Grant 7,323,250 - Tabei , et al. January 29, 2	2008-01-29
Organosilicon Compound App 20070290202 - Matsumoto; Nobuaki ; et al.	2007-12-20
Heat Conductive Silicone Grease Composition App 20070293624 - MATSUMOTO; Nobuaki ; et al.	2007-12-20
Production Method For Semiconductor Device App 20070224800 - Miyoshi; Kei	2007-09-27
Heat Conductive Silicone Grease Compositions App 20070149834 - Endo; Akihiro ; et al.	2007-06-28
Addition Curing Silicone Composition Capable Of Producing A Cured Product With Excellent Crack Resistance App 20070073026 - MIYOSHI; Kei	2007-03-29
Heat conductive silicone grease composition and cured product thereof App 20070042533 - Endo; Akihiro ; et al.	2007-02-22
Addition Curable Silicone Resin Composition For Light Emitting Diode App 20070032595 - Yamakawa; Naoki ; et al.	2007-02-08
Silicone resin composition for die bonding App 20060275617 - Miyoshi; Kei ; et al.	2006-12-07
Silicone-sealed LED App 20060159937 - Miyoshi; Kei ; et al.	2006-07-20
RTV heat conductive silicone rubber compositions App 20060079634 - Horikoshi; Jun ; et al.	2006-04-13
Heat conductive silicone rubber composition and molded article App 20050256259 - Goto, Tomoyuki ; et al.	2005-11-17
Curable silicone resin composition, sealing material for optical semiconductor, and optical semiconductor device App 20050213926 - Tabei, Eiichi ; et al.	2005-09-29
LED devices and silicone resin composition therefor App 20050212008 - Miyoshi, Kei	2005-09-29
RTV heat conductive silicone rubber compositions App 20040242762 - Horikoshi, Jun ; et al.	2004-12-02
Silicone resin composition for LED devices App 20040116640 - Miyoshi, Kei	2004-06-17
Hydrosilylation catalysts and silicone compositions using the same Grant 6,140,446 - Fujiki , et al. October 31, 2	2000-10-31
Mildew resistant organopolysiloxane with hydrolyzable organosilane and triazolyl compound Grant 6,008,290 - Miyoshi , et al. December 28, 1	1999-12-28
Room temperature curable organopolysiloxane composition Grant 5,514,741 - Arai , et al. May 7, 1	1996-05-07
Room temperature quick curable organopolysiloxane composition excellent in water resistance Grant 5,482,992 - Kimura , et al. January 9, 1	1996-01-09
Room temperature vulcanizable, foamable polysiloxane composition Grant 5,216,037 - Miyoshi , et al. June 1, 1	1993-06-01

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