Miyoshi; Hiromasa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyoshi; Hiromasa.The latest application filed is for "joining material and joining method using same".

Company Profile

3.14.19

Miyoshi; Hiromasa - Tokyo JP
Miyoshi; Hiromasa - Okayama JP
MIYOSHI; Hiromasa - Chiyoda-ku, Tokyo JP
Miyoshi, Hiromasa - Okayama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Joining material and joining method using same Grant 11,453,053 - Kurita , et al. September 27, 2	2022-09-27
Bonding material and bonding method using same Grant 10,903,185 - Endoh , et al. January 26, 2	2021-01-26
Bonding material and bonding method using same Grant 10,821,558 - Endoh , et al. November 3, 2	2020-11-03
Bonding material and bonding method using same Grant 10,543,569 - Kurita , et al. Ja	2020-01-28
Bonding material and bonding method using same Grant 10,328,534 - Endoh , et al.	2019-06-25
Joining Material And Joining Method Using Same App 20190118257 - Kurita; Satoru ; et al.	2019-04-25
Method For Joining Electronic Part Using A Joining Silver Sheet App 20180331063 - KURITA; Satoru ; et al.	2018-11-15
Fine silver particle dispersing solution Grant 9,914,845 - Hinotsu , et al. March 13, 2	2018-03-13
Bonding Material And Bonding Method Using Same App 20170252874 - Endoh; Keiichi ; et al.	2017-09-07
Metal nanoparticle dispersion, method for producing metal nanoparticle dispersion, and bonding method Grant 9,662,748 - Endoh , et al. May 30, 2	2017-05-30
Bonding Material And Bonding Method Using Same App 20170120395 - Kurita; Satoru ; et al.	2017-05-04
Bonding Material And Bonding Method Using Same App 20170077057 - Endoh; Keiichi ; et al.	2017-03-16
Fine Silver Particle Dispersing Solution App 20160297982 - Hinotsu; Takashi ; et al.	2016-10-13
Joining Silver Sheet, Method For Manufacturing Same, And Method For Joining Electronic Part App 20160254243 - KURITA; Satoru ; et al.	2016-09-01
Bonding Material And Bonding Method Using Same App 20160136763 - Endoh; Keiichi ; et al.	2016-05-19
Metal Paste For Joining, Joining Method And Joined Body App 20160121435 - FURUKAWA; Masashi ; et al.	2016-05-05
Metal Nanoparticle Dispersion, Method For Producing Metal Nanoparticle Dispersion, And Bonding Method App 20160101486 - ENDOH; Keiichi ; et al.	2016-04-14
Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same Grant 8,673,049 - Jablonski , et al. March 18, 2	2014-03-18
Low-temperature Sintered Silver Nanoparticle Composition And Electronic Articles Formed Using The Same App 20120177897 - Jablonski; Gregory A. ; et al.	2012-07-12
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste Grant 7,235,119 - Sano , et al. June 26, 2	2007-06-26
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste Grant 6,923,924 - Sano , et al. August 2, 2	2005-08-02
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste App 20050161643 - Sano, Kazushi ; et al.	2005-07-28
Copper powder for electrically conductive paste Grant 6,881,240 - Sano , et al. April 19, 2	2005-04-19
Copper powder and process for producing copper powder Grant 6,875,252 - Sano , et al. April 5, 2	2005-04-05
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste App 20040026669 - Sano, Kazushi ; et al.	2004-02-12
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste Grant 6,620,344 - Sano , et al. September 16, 2	2003-09-16
Copper powder for electrically conductive paste App 20030089199 - Sano, Kazushi ; et al.	2003-05-15
Copper powder and process for producing copper powder App 20030015062 - Sano, Kazushi ; et al.	2003-01-23
Silver-dispersed copper powder, process for producing the powder and conductive paste utilizing the powder App 20020117652 - Sano, Kazushi ; et al.	2002-08-29
Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste App 20010003362 - Sano, Kazushi ; et al.	2001-06-14
Copper powder and process for producing copper powder App 20010002558 - Sano, Kazushi ; et al.	2001-06-07

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