Miyazawa; Sugio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyazawa; Sugio.The latest application filed is for "temporary-fixing substrate and method for molding electronic component".

Company Profile

6.26.31

Miyazawa; Sugio - Kasugai JP
MIYAZAWA; Sugio - Kasugai-City JP
MIYAZAWA; Sugio - Kasugai-shi JP
Miyazawa; Sugio - Kasuagi JP
Miyazawa; Sugio - Nagoya JP
Miyazawa, Sugio - Aichi-pref JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing connection substrate Grant 11,013,127 - Takagaki , et al. May 18, 2	2021-05-18
Temporary-fixing Substrate And Method For Molding Electronic Component App 20200027755 - NOMURA; Masaru ; et al.	2020-01-23
Temporary-fixing Substrate And Method For Temporarily Fixing Electronic Component App 20200027771 - NOMURA; Masaru ; et al.	2020-01-23
Connection substrate Grant 10,278,286 - Ide , et al.	2019-04-30
Connection substrate Grant 10,257,941 - Miyazawa , et al.	2019-04-09
Handle substrate of composite substrate for semiconductor, and composite substrate for semiconductor Grant 10,204,838 - Ide , et al. Feb	2019-02-12
Connection Substrate App 20190014663 - IDE; Akiyoshi ; et al.	2019-01-10
Method For Producing Connection Substrate App 20180359865 - TAKAGAKI; Tatsuro ; et al.	2018-12-13
Connection Substrate App 20180359866 - MIYAZAWA; Sugio ; et al.	2018-12-13
Insulating substrates including through holes Grant 9,894,763 - Takagaki , et al. February 13, 2	2018-02-13
Composite substrate, semiconductor device, and method for manufacturing semiconductor device Grant 9,812,345 - Ide , et al. November 7, 2	2017-11-07
Handle substrates of composite substrates for semiconductors Grant 9,676,670 - Miyazawa June 13, 2	2017-06-13
Handle substrates of composite substrates for semiconductors, and composite substrates for semiconductors Grant 9,673,282 - Miyazawa , et al. June 6, 2	2017-06-06
Composite substrate Grant 9,595,657 - Hori , et al. March 14, 2	2017-03-14
Insulating substrates including through holes Grant 9,538,653 - Takagaki , et al. January 3, 2	2017-01-03
Handle Substrate of Composite Substrate for Semiconductor, and Composite Substrate for Semiconductor App 20160358828 - Ide; Akiyoshi ; et al.	2016-12-08
Handle substrates of composite substrates for semiconductors Grant 9,469,571 - Iwasaki , et al. October 18, 2	2016-10-18
Handle substrate, composite substrate for semiconductor, and semiconductor circuit board and method for manufacturing the same Grant 9,425,083 - Miyazawa , et al. August 23, 2	2016-08-23
Handle substrate and composite wafer for semiconductor device Grant 9,390,955 - Takagaki , et al. July 12, 2	2016-07-12
Window Material For Ultraviolet-ray-emitting Element And Method For Producing Same App 20160096776 - NOMURA; Masaru ; et al.	2016-04-07
Handle substrates of composite substrates for semiconductors Grant 9,305,827 - Ide , et al. April 5, 2	2016-04-05
Handle Substrates for Composite Substrates for Semiconductors App 20160046528 - Miyazawa; Sugio ; et al.	2016-02-18
Insulating Substrates Including Through Holes App 20160007461 - Takagaki; Tatsuro ; et al.	2016-01-07
Handle Substrate, Composite Substrate for Semiconductor, and Semiconductor Circuit Board and Method for Manufacturing the Same App 20160005643 - Miyazawa; Sugio ; et al.	2016-01-07
Handle Substrates of Composite Substrates for Semiconductors App 20150376066 - Miyazawa; Sugio	2015-12-31
Composite Substrate, Semiconductor Device, And Method For Manufacturing Semiconductor Device App 20150380290 - Ide; Akiyoshi ; et al.	2015-12-31
Handle Substrates of Composite Substrates for Semiconductors, and Composite Substrates for Semiconductors App 20150364548 - Miyazawa; Sugio ; et al.	2015-12-17
Insulating Substrates Including Through Holes App 20150353428 - Takagaki; Tatsuro ; et al.	2015-12-10
Handle Substrate and Composite Wafer for Semiconductor Device App 20150357221 - Takagaki; Tatsuro ; et al.	2015-12-10
Handle Substrates of Composite Substrates for Semiconductors App 20150232389 - Iwasaki; Yasunori ; et al.	2015-08-20
Handle Substrates of Composite Substrates for Semiconductors App 20150179504 - Ide; Akiyoshi ; et al.	2015-06-25
Handle Substrates of Composite Substrates for Semiconductors App 20150132540 - Ide; Akiyoshi ; et al.	2015-05-14
Composite Substrate App 20150102707 - Hori; Yuji ; et al.	2015-04-16
Composite wafer and method for manufacturing the same Grant 8,981,531 - Iwasaki , et al. March 17, 2	2015-03-17
Composite Wafer and Method for Manufacturing the Same App 20140191373 - Iwasaki; Yasunori ; et al.	2014-07-10
Ceramic tube for high-intensity discharge lamp and method of producing the same Grant 8,420,932 - Miyazawa , et al. April 16, 2	2013-04-16
Method Of Producing Ceramic Substrates App 20120267412 - MIYAZAWA; Sugio ; et al.	2012-10-25
Translucent polycrystalline sintered body, method for producing the same, and arc tube for high-intensity discharge lamp Grant 8,278,233 - Miyazawa , et al. October 2, 2	2012-10-02
Arc Tube And Method Of Manufacturing Same App 20120133279 - MIYAZAWA; Sugio ; et al.	2012-05-31
Ceramic Tube For High-intensity Discharge Lamp And Method Of Producing The Same App 20110114352 - MIYAZAWA; Sugio ; et al.	2011-05-19
Translucent Polycrystalline Sintered Body, Method For Producing The Same, And Arc Tube For High-intensity Discharge Lamp App 20110059839 - MIYAZAWA; Sugio ; et al.	2011-03-10
Method of manufacturing ceramic green body Grant 7,517,490 - Miyazawa April 14, 2	2009-04-14
Core for molding hollow ceramic molded body and light emitting container Grant 7,407,145 - Miyazawa , et al. August 5, 2	2008-08-05
Discharge tube for high-pressure discharge lamp and high-pressure discharge lamp Grant 7,057,348 - Miyazawa June 6, 2	2006-06-06
Method of manufacturing a high pressure discharge lamp vessel Grant 7,041,240 - Miyazawa , et al. May 9, 2	2006-05-09
Method of manufacturing molded body, slurry for molding, core for molding, method of manufacturing core for molding, hollow ceramic molded body, and light emitting container App 20050287319 - Miyazawa, Sugio ; et al.	2005-12-29
High pressure discharge vessel for an alumina high-intensity discharge lamp Grant 6,969,951 - Miyazawa , et al. November 29, 2	2005-11-29
Method of manufacturing molded body, slurry for molding, core for molding, method of manufacturing core for molding, hollow ceramic molded body, and light emitting container Grant 6,953,503 - Miyazawa , et al. October 11, 2	2005-10-11
Method of manufacturing ceramic green body App 20050212185 - Miyazawa, Sugio	2005-09-29
Discharge tube for high-pressure discharge lamp and high-pressure discharge lamp App 20040201353 - Miyazawa, Sugio	2004-10-14
Ceramic envelope for intensity discharge lamp Grant 6,781,311 - Miyazawa August 24, 2	2004-08-24
Ceramic envelope for high intensity discharge lamp Grant 6,747,411 - Miyazawa June 8, 2	2004-06-08
Method of manufacturing molded body, slurry for molding, core for molding, method of manufacturing core for molding, hollow ceramic molded body, and light emitting container App 20030190275 - Miyazawa, Sugio ; et al.	2003-10-09
Vessel for a high pressure discharge lamp and method of manufacturing the same App 20030096551 - Miyazawa, Sugio ; et al.	2003-05-22
Ceramic envelope for intensity discharge lamp App 20020089286 - Miyazawa, Sugio	2002-07-11
Ceramic envelope for high intensity discharge lamp App 20020070667 - Miyazawa, Sugio	2002-06-13

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