Miyazawa; Hiroaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miyazawa; Hiroaki.The latest application filed is for "wire insertion tool".
- Miyazawa; Hiroaki - Tokyo JP
- Miyazawa; Hiroaki - Shinjuku-Ku JP
- Miyazawa; Hiroaki - Tokyo-to JP
| Patent | Date |
|---|---|
| Method for inserting a wire into a contact pin with a wire insertion tool Grant 8,991,044 - Soma , et al. March 31, 2 | 2015-03-31 |
| Wire Insertion Tool App 20130312259 - SOMA; Fumihito ; et al. | 2013-11-28 |
| Wire insertion tool Grant 8,578,590 - Soma , et al. November 12, 2 | 2013-11-12 |
| Substrate for suspension Grant 8,399,774 - Hitomi , et al. March 19, 2 | 2013-03-19 |
| Wire Insertion Tool App 20120255168 - SOMA; Fumihito ; et al. | 2012-10-11 |
| Substrate For Suspension App 20120090878 - HITOMI; Yoichi ; et al. | 2012-04-19 |
| Substrate for suspension Grant 8,097,811 - Hitomi , et al. January 17, 2 | 2012-01-17 |
| Magnetic head suspension Grant 8,040,634 - Miyazawa , et al. October 18, 2 | 2011-10-18 |
| Magnetic Head Suspension App 20090310260 - Miyazawa; Hiroaki ; et al. | 2009-12-17 |
| Substrate For Suspension App 20080247131 - Hitomi; Yoichi ; et al. | 2008-10-09 |
| Inspection contact sheet and method of fabricating the same App 20040101666 - Tsubosaki, Kunihiro ; et al. | 2004-05-27 |
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