Miyawaki; Katsumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miyawaki; Katsumi.The latest application filed is for "semiconductor device".
- Miyawaki; Katsumi - Tokyo JP
- MIYAWAKI; Katsumi - Chiyoda-ku Tokyo
- Miyawaki; Katsumi - Hofu JA
| Patent | Date |
|---|---|
| Semiconductor package Grant 11,315,842 - Utsumi , et al. April 26, 2 | 2022-04-26 |
| Semiconductor device Grant 11,309,231 - Ichinohe , et al. April 19, 2 | 2022-04-19 |
| Semiconductor device Grant 11,251,107 - Ichinohe , et al. February 15, 2 | 2022-02-15 |
| Microwave device and antenna for improving heat dissipation Grant 11,205,623 - Tarui , et al. December 21, 2 | 2021-12-21 |
| Microwave device and antenna for improving heat dissipation Grant 11,152,310 - Tarui , et al. October 19, 2 | 2021-10-19 |
| Semiconductor device Grant 11,121,099 - Ito , et al. September 14, 2 | 2021-09-14 |
| Semiconductor Device App 20210242144 - MORIWAKI; Takao ; et al. | 2021-08-05 |
| Microwave Device And Antenna App 20210233865 - TARUI; Yukinobu ; et al. | 2021-07-29 |
| Semiconductor Package App 20210225717 - UTSUMI; Hiromitsu ; et al. | 2021-07-22 |
| Semiconductor Device App 20210175150 - ICHINOHE; Hiroaki ; et al. | 2021-06-10 |
| Microwave Device And Antenna App 20210134733 - TARUI; Yukinobu ; et al. | 2021-05-06 |
| Semiconductor Device App 20210074612 - MIYAWAKI; Katsumi | 2021-03-11 |
| Semiconductor device Grant 10,923,444 - Miyawaki , et al. February 16, 2 | 2021-02-16 |
| Semiconductor device, and method of manufacturing the same Grant 10,916,520 - Ishida , et al. February 9, 2 | 2021-02-09 |
| Semiconductor device Grant 10,854,523 - Nishizawa , et al. December 1, 2 | 2020-12-01 |
| Semiconductor Package App 20200321261 - FUJINO; Junji ; et al. | 2020-10-08 |
| Semiconductor Device App 20200273825 - ITO; Masayasu ; et al. | 2020-08-27 |
| Semiconductor Device App 20200185285 - NISHIZAWA; Koichiro ; et al. | 2020-06-11 |
| Semiconductor device and method of manufacturing the same Grant 10,373,898 - Iwai , et al. | 2019-08-06 |
| Semiconductor Device And Method Of Manufacturing The Same App 20180158794 - ISHIDA; Kiyoshi ; et al. | 2018-06-07 |
| Semiconductor Device And Method Of Manufacturing The Same App 20180005926 - IWAI; Yuji ; et al. | 2018-01-04 |
| Radiofrequency high-output device Grant 9,685,392 - Miyawaki , et al. June 20, 2 | 2017-06-20 |
| High-frequency, High-output Device Unit App 20170053860 - TSURUMAKI; Takashi ; et al. | 2017-02-23 |
| Radiofrequency High-output Device App 20160336255 - MIYAWAKI; Katsumi ; et al. | 2016-11-17 |
| Semiconductor device and a method for manufacturing semiconductor device Grant 9,455,245 - Miyawaki September 27, 2 | 2016-09-27 |
| Semiconductor Device And A Method For Manufacturing Semiconductor Device App 20150279760 - MIYAWAKI; Katsumi | 2015-10-01 |
| Semiconductor device Grant 9,018,775 - Yamamoto , et al. April 28, 2 | 2015-04-28 |
| Semiconductor Device App 20150008596 - Yamamoto; Yasukazu ; et al. | 2015-01-08 |
| Semiconductor device Grant 7,626,275 - Ito , et al. December 1, 2 | 2009-12-01 |
| Molded semiconductor package Grant 7,414,300 - Takasou , et al. August 19, 2 | 2008-08-19 |
| Semiconductor Device And Die Bonding Method Therefor App 20070138650 - ITO; Masayasu ; et al. | 2007-06-21 |
| Molded semiconductor package App 20070069343 - Takasou; Jun ; et al. | 2007-03-29 |
| Method And Apparatus For Counting The Number Of Individual Filaments Composing A Multifilament Yarn Grant 3,800,160 - Ishizawa , et al. March 26, 1 | 1974-03-26 |
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