Miyauchi; Masahiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyauchi; Masahiko.The latest application filed is for "novel amide acid oligomer process for molding polyimide composites".

Company Profile

3.10.12

Miyauchi; Masahiko - Pasadena TX
Miyauchi; Masahiko - College Station TX
Miyauchi; Masahiko - Osaka JP
Miyauchi; Masahiko - Settsu N/A JP
Miyauchi; Masahiko - Settsu-shi JP
Miyauchi; Masahiko - Kirishima JP
Miyauchi; Masahiko - Kirishima-shi JP
Miyauchi; Masahiko - Kokubu JP
Miyauchi, Masahiko - Kokubu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Novel Amide Acid Oligomer Process For Molding Polyimide Composites App 20210340344 - Miyauchi; Masahiko	2021-11-04
Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4'-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance an Grant 10,815,390 - Miyauchi , et al. October 27, 2	2020-10-27
Terminally modified imide oligomer, varnish, cured products thereof, film, and imide prepreg and fiber-reinforced composite material using these Grant 10,526,450 - Furuta , et al. J	2020-01-07
Terminally Modified Imide Oligomer, Varnish, Cured Products Thereof, Film, And Imide Prepreg And Fiber-reinforced Composite Material Using These App 20190071541 - Furuta; Takefumi ; et al.	2019-03-07
Polyimide Resin Composition And Varnish Produced From Terminal-modified Imide Oligomer Prepared Using 2-phenyl-4,4'-diaminodiphenyl Ether And Thermoplastic Aromatic Polyimide Prepared Using Oxydiphthalic Acid, Polyimide Resin Composition Molded Article And Prepreg Having Excellent Heat Resistance An App 20180273798 - Miyauchi; Masahiko ; et al.	2018-09-27
Varnish including 2-phenyl-4,4'-diaminodiphenyl ether, imide resin composition having excellent moldability, cured resin molded article having excellent breaking elongation, prepreg thereof, imide prepreg thereof, and fiber-reinforced material thereof having high heat resistance and excellent mechan Grant 10,047,246 - Miyauchi , et al. August 14, 2	2018-08-14
Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4'-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance an Grant 10,017,666 - Miyauchi , et al. July 10, 2	2018-07-10
Varnish Including 2-phenyl-4,4'-diaminodiphenyl Ether, Imide Resin Composition Having Excellent Moldability, Cured Resin Molded Article Having Excellent Breaking Elongation, Prepreg Thereof, Imide Prepreg Thereof, And Fiber-reinforced Material Thereof Having High Heat Resistance And Excellent Mechan App 20170152399 - Miyauchi; Masahiko ; et al.	2017-06-01
Polyimide Resin Composition And Varnish Produced From Terminal-modified Imide Oligomer Prepared Using 2-phenyl-4,4'-diaminodiphenyl Ether And Thermoplastic Aromatic Polyimide Prepared Using Oxydiphthalic Acid, Polyimide Resin Composition Molded Article And Prepreg Having Excellent Heat Resistance An App 20160083618 - Miyauchi; Masahiko ; et al.	2016-03-24
Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4'diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resi Grant 9,051,430 - Miyauchi , et al. June 9, 2	2015-06-09
Soluble terminally modified imide oligomer using 2-phenyl-4, 4'-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance Grant 8,846,552 - Miyauchi , et al. September 30, 2	2014-09-30
Resin-transfer-moldable Terminal-modified Imide Oligomer Using 2-phenyl-4,4' Diaminodiphenyl Ether And Having Excellent Moldability, Mixture Thereof, Varnish Containing Same, And Cured Resin Thereof And Fiber-reinforced Cured Resin Thereof Made By Resin Transfer Molding And Having Excellent Heat Res App 20140011950 - Miyauchi; Masahiko ; et al.	2014-01-09
Carbon Fiber Reinforced Composite Materials App 20120295504 - Miyauchi; Masahiko ; et al.	2012-11-22
Soluble Terminally Modified Imide Oligomer Using 2-phenyl-4, 4'-diaminodiphenyl Ether, Varnish, Cured Product Thereof, Imide Prepreg Thereof, And Fiber-reinforced Laminate Having Excellent Heat Resistance App 20110165809 - Miyauchi; Masahiko ; et al.	2011-07-07
Package for receiving electronic parts, and electronic device and mounting structure thereof Grant 7,745,914 - Miyauchi June 29, 2	2010-06-29
Reaction Apparatus, Fuel Cell System and Electronic Device App 20100086813 - Yamamoto; Tadao ; et al.	2010-04-08
Package for receiving electronic parts, and electronic device and mounting structure thereof App 20060249835 - Miyauchi; Masahiko	2006-11-09
Heat releasing member, package for accommodating semiconductor element and semiconductor device Grant 6,921,971 - Basho , et al. July 26, 2	2005-07-26
Heat releasing member, package for accommodating semiconductor element and semiconductor device App 20050035447 - Basho, Yoshihiro ; et al.	2005-02-17

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