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Miyauchi; Koji Patent Filings

Miyauchi; Koji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyauchi; Koji.The latest application filed is for "shielded socket and carrier for high-volume test of semiconductor devices".

Company Profile
1.4.8
  • Miyauchi; Koji - San Jose CA
  • Miyauchi; Koji - Tokyo JP
  • Miyauchi; Koji - Higashiomi-shi JP
  • Miyauchi; Koji - Kanagawa JP
  • Miyauchi; Koji - Kawasaki JP
  • Miyauchi; Koji - Hyogo JP
  • Miyauchi, Koji - Himeji-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Shielded Socket And Carrier For High-volume Test Of Semiconductor Devices
App 20220137092 - Ranganathan; Karthik ;   et al.
2022-05-05
Test apparatus and test method
Grant 11,137,446 - Inage , et al. October 5, 2
2021-10-05
Test Apparatus And Test Method
App 20200225286 - INAGE; Shuichi ;   et al.
2020-07-16
Photoelectric Conversion Cell, Photoelectric Conversion Module, and Method for Manufacturing Photoelectric Conversion Cell
App 20110284051 - Miyauchi; Koji
2011-11-24
Community Generation Support System, Community Generation Support Method, And Community Generation Support Program
App 20100211674 - Sugahara; Taro ;   et al.
2010-08-19
Method and device for calculating trust values on purchases
Grant 7,707,068 - Miyauchi April 27, 2
2010-04-27
Access Control Device And Method Thereof
App 20090024629 - Miyauchi; Koji
2009-01-22
Heating unit for heating a workpiece with light-absorbing heat conducting layer
Grant 7,218,847 - Mizukawa , et al. May 15, 2
2007-05-15
Method for thermal processing semiconductor wafer with a flash discharge lamp after preheating to a predetermined temperature
Grant 6,897,130 - Miyauchi , et al. May 24, 2
2005-05-24
Method and device for calculating trust values on purchases
App 20050096987 - Miyauchi, Koji
2005-05-05
Heating unit
App 20050089317 - Mizukawa, Yoichi ;   et al.
2005-04-28
Method for thermal processing semiconductor wafer
App 20030114019 - Miyauchi, Koji ;   et al.
2003-06-19

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