Miyauchi; Kazuhiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyauchi; Kazuhiro.The latest application filed is for "reflow film, solder bump formation method, solder joint formation method, and semiconductor device".

Company Profile

0.6.6

Miyauchi; Kazuhiro - Tsukuba JP
Miyauchi; Kazuhiro - Tsukuba-shi Ibaraki JP
Miyauchi; Kazuhiro - Ibaraki JP
Miyauchi; Kazuhiro - Toyota JP
Miyauchi; Kazuhiro - Ibaraki-ken JP
Miyauchi, Kazuhiro - Toyota-shi JP
Miyauchi; Kazuhiro - Tokyo JA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reflow film, solder bump formation method, solder joint formation method, and semiconductor device Grant 9,656,353 - Miyauchi , et al. May 23, 2	2017-05-23
Reflow Film, Solder Bump Formation Method, Solder Joint Formation Method, And Semiconductor Device App 20140252607 - Miyauchi; Kazuhiro ; et al.	2014-09-11
Adhesive Composition, Bonding Member Using The Adhesive Composition, Support Member For Semiconductor Mounting, Semiconductor Device, And Processes For Producing These App 20110001251 - Gou; Yutaka ; et al.	2011-01-06
Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board Grant 7,736,749 - Baba , et al. June 15, 2	2010-06-15
Thermosetting Resin Composition, Resin Film, Metallic Foil Provided With An Insulation Material, Insulation Film Provided With A Metallic Foil On Each Side, Metal-clad Laminate, Multi-layered Metal-clad Laminate, And Multi-layered Printed Wiring Board App 20070037950 - BABA; Hideo ; et al.	2007-02-15
Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board Grant 7,166,361 - Baba , et al. January 23, 2	2007-01-23
System and method for product designing, and recording medium Grant 7,016,749 - Kuzumaki , et al. March 21, 2	2006-03-21
Thermosetting resin composition and process for producing the same Grant 6,787,614 - Takano , et al. September 7, 2	2004-09-07
Process for producing novel silicone polymer, silicone polymer produced by the same process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed App 20030171477 - Baba, Hideo ; et al.	2003-09-11
System and method for product designing, and recording medium App 20030115026 - Kuzumaki, Seigo ; et al.	2003-06-19
Thermosetting resin composition and process for producing the same App 20020193519 - Takano, Nozomu ; et al.	2002-12-19
Demodulator for combined digital amplitude and phase keyed modulation signals Grant 4,039,961 - Ishio , et al. August 2, 1	1977-08-02

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