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Film Forming Apparatus
App 20160348238 - Nakata; Rempei ; et al. | 2016-12-01 |
Semiconductor Manufacturing Equipment And Manufacturing Method Of Semiconductor Device
App 20150255317 - SUGURO; KYOICHI ; et al. | 2015-09-10 |
Method for manufacturing semiconductor device and polishing apparatus
Grant 7,351,131 - Nakamura , et al. April 1, 2 | 2008-04-01 |
Method of predicting initial input of new product, system for predicting initial input of new product, and recording medium
Grant 7,246,079 - Ando , et al. July 17, 2 | 2007-07-17 |
Polishing method and apparatus
Grant 7,101,259 - Kimura , et al. September 5, 2 | 2006-09-05 |
Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
Grant 7,005,382 - Nishimoto , et al. February 28, 2 | 2006-02-28 |
Method for manufacturing semiconductor device and polishing apparatus
App 20050250423 - Nakamura, Kenro ; et al. | 2005-11-10 |
Method for manufacturing semiconductor device and polishing apparatus
Grant 6,933,234 - Nakamura , et al. August 23, 2 | 2005-08-23 |
Method of chemical/mechanical polishing of the surface of semiconductor device
Grant 6,867,138 - Miyashita , et al. March 15, 2 | 2005-03-15 |
Electropolishing method
Grant 6,783,658 - Matsui , et al. August 31, 2 | 2004-08-31 |
Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
App 20040132305 - Nishimoto, Kazuo ; et al. | 2004-07-08 |
Polishing method and apparatus
App 20040087258 - Kimura, Norio ; et al. | 2004-05-06 |
Method and apparatus for forming electrolytic water and apparatus for washing semiconductor substrate using electrolytic water-forming apparatus
Grant 6,723,226 - Takayasu , et al. April 20, 2 | 2004-04-20 |
Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
Grant 6,716,087 - Miyashita , et al. April 6, 2 | 2004-04-06 |
Polishing method and apparatus
Grant 6,667,238 - Kimura , et al. December 23, 2 | 2003-12-23 |
Method for manufacturing semiconductor device and polishing apparatus
App 20030139049 - Nakamura, Kenro ; et al. | 2003-07-24 |
Electropolishing method
App 20030066760 - Matsui, Yoshitaka ; et al. | 2003-04-10 |
Method of chemical/mechanical polishing of the surface of semiconductor device
App 20020192962 - Miyashita, Naoto ; et al. | 2002-12-19 |
Method of predicting initial input of new product, system for predicting initial input of new product, and recording medium
App 20020082902 - Ando, Hideyuki ; et al. | 2002-06-27 |
Abrasive and method for polishing semiconductor substrate
Grant 6,354,913 - Miyashita , et al. March 12, 2 | 2002-03-12 |
Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
App 20010029156 - Miyashita, Naoto ; et al. | 2001-10-11 |
Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
Grant 6,241,581 - Miyashita , et al. June 5, 2 | 2001-06-05 |
Double side cleaning apparatus for semiconductor substrate
Grant 6,167,583 - Miyashita , et al. January 2, 2 | 2001-01-02 |
Method of manufacturing a semiconductor device and an apparatus for manufacturing the same
Grant 6,098,638 - Miyashita , et al. August 8, 2 | 2000-08-08 |
Apparatus and method for manufacturing electrolytic ionic water and washing method using electroyltic ionic water
Grant 6,007,696 - Takayasu , et al. December 28, 1 | 1999-12-28 |
Method for purifying pure water and an apparatus for the same
Grant 6,001,238 - Takayasu , et al. December 14, 1 | 1999-12-14 |
Method for producing electrolytic ionic water and an apparatus for the same
Grant 5,993,639 - Miyashita , et al. November 30, 1 | 1999-11-30 |
Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
Grant 5,922,620 - Shimomura , et al. July 13, 1 | 1999-07-13 |
Heat treatment apparatus for semiconductor wafers
Grant 5,878,191 - Miyashita , et al. March 2, 1 | 1999-03-02 |
Polishing slurry
Grant 5,861,054 - Miyashita , et al. January 19, 1 | 1999-01-19 |
Method of fabricating trench isolation structure having tapered opening
Grant 5,683,908 - Miyashita , et al. November 4, 1 | 1997-11-04 |
Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer
Grant 5,643,046 - Katakabe , et al. July 1, 1 | 1997-07-01 |
Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus
Grant 5,643,406 - Shimomura , et al. July 1, 1 | 1997-07-01 |
Polishing apparatus of semiconductor wafer
Grant 5,605,488 - Ohashi , et al. February 25, 1 | 1997-02-25 |
Method of treating semiconductor substrates
Grant 5,380,399 - Miyashita , et al. January 10, 1 | 1995-01-10 |
Device for thermal treatment and film forming process
Grant 5,346,555 - Nunotani , et al. September 13, 1 | 1994-09-13 |
Method of manufacturing semiconductor device having elements isolated by trench
Grant 5,332,683 - Miyashita , et al. July 26, 1 | 1994-07-26 |
Semiconductor manufacturing apparatus including a temperature control mechanism
Grant 5,029,554 - Miyashita , et al. July 9, 1 | 1991-07-09 |
Method of manufacturing a semiconductor device having rounded trench corners
Grant 4,916,086 - Takahashi , et al. April 10, 1 | 1990-04-10 |
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