Miyanari; Atsushi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miyanari; Atsushi.The latest application filed is for "bonding method and bonding apparatus".
Company Profile
1.34.31
- Miyanari; Atsushi - Kawasaki JP
- Miyanari; Atsushi - Kanagawa N/A JP
- Miyanari; Atsushi - Kawasaki-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Bonding method and bonding apparatus Grant 9,962,915 - Miyanari , et al. May 8, 2 | 2018-05-08 |
| Retention device and retention method Grant 9,406,542 - Miyanari August 2, 2 | 2016-08-02 |
| Cleaning device, cleaning method, and composition Grant 9,010,343 - Miyanari April 21, 2 | 2015-04-21 |
| Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate Grant 8,931,535 - Nakamura , et al. January 13, 2 | 2015-01-13 |
| Bonding Method And Bonding Apparatus App 20140374017 - Miyanari; Atsushi ; et al. | 2014-12-25 |
| Perforated support plate Grant 8,882,096 - Nakamura , et al. November 11, 2 | 2014-11-11 |
| Method for processing process-target object Grant 8,882,930 - Miyanari November 11, 2 | 2014-11-11 |
| Method For Forming Laminate App 20140151328 - Miyanari; Atsushi ; et al. | 2014-06-05 |
| Processing apparatus fluid-processing a process target body Grant 8,720,456 - Miyanari May 13, 2 | 2014-05-13 |
| Retention Device And Retention Method App 20140109941 - Miyanari; Atsushi | 2014-04-24 |
| Perforated Support Plate App 20130333833 - NAKAMURA; Akihiko ; et al. | 2013-12-19 |
| Liquid solvent abutment unit Grant 8,449,691 - Nakamura , et al. May 28, 2 | 2013-05-28 |
| Bonding apparatus, method for preventing dissolving of adhesive agent, and bonding method Grant 8,425,713 - Ohya , et al. April 23, 2 | 2013-04-23 |
| Adhesive composition and adhesive film Grant 8,426,543 - Asai , et al. April 23, 2 | 2013-04-23 |
| Adhesive composition and film adhesive Grant 8,357,750 - Tamura , et al. January 22, 2 | 2013-01-22 |
| Attaching Device And Attaching Apparatus For Supporting Plate, And Attaching Method For Supporting Plate App 20120132359 - NAKAMURA; Akihiko ; et al. | 2012-05-31 |
| Separating device Grant 8,186,410 - Nakamura , et al. May 29, 2 | 2012-05-29 |
| Method of thinning wafer and support plate Grant 8,167,687 - Nakamura , et al. May 1, 2 | 2012-05-01 |
| Adhesive composition and adhesive film Grant 8,163,836 - Misumi , et al. April 24, 2 | 2012-04-24 |
| Adhesive composition and film adhesive Grant 8,148,457 - Asai , et al. April 3, 2 | 2012-04-03 |
| Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate Grant 8,136,564 - Nakamura , et al. March 20, 2 | 2012-03-20 |
| Cleaning Device, Cleaning Method, And Composition App 20120031443 - Miyanari; Atsushi | 2012-02-09 |
| Method of cleaning support plate Grant 8,097,087 - Mitake , et al. January 17, 2 | 2012-01-17 |
| Supporting plate, apparatus and method for stripping supporting plate Grant 8,080,123 - Nakamura , et al. December 20, 2 | 2011-12-20 |
| Method For Processing Process-target Object App 20110297190 - MIYANARI; Atsushi | 2011-12-08 |
| Process for producing an adhesive composition Grant 7,999,052 - Asai , et al. August 16, 2 | 2011-08-16 |
| Supporting Plate, Apparatus And Method For Stripping Supporting Plate App 20110146899 - NAKAMURA; Akihiko ; et al. | 2011-06-23 |
| Method for thinning substrate and method for manufacturing circuit device Grant 7,919,394 - Nakamura , et al. April 5, 2 | 2011-04-05 |
| Adhesive Composition And Film Adhesive App 20100331477 - TAMURA; Koki ; et al. | 2010-12-30 |
| Stripping device and stripping apparatus Grant 7,849,905 - Nakamura , et al. December 14, 2 | 2010-12-14 |
| Adhesive Composition, Film Adhesive, And Process For Production Of The Composition App 20100227996 - Asai; Takahiro ; et al. | 2010-09-09 |
| Adhesive Composition, Film Adhesive, And Process For Production Of The Composition App 20100178497 - Asai; Takahiro ; et al. | 2010-07-15 |
| Bonding Apparatus, Method For Preventing Dissolving Of Adhesdive Agent, And Bonding Method App 20100096080 - Ohya; Satoshi ; et al. | 2010-04-22 |
| Adhesive Composition And Film Adhesive App 20100075141 - Asai; Takahiro ; et al. | 2010-03-25 |
| Adhesive Composition And Adhesive Film App 20100069593 - Asai; Takahiro ; et al. | 2010-03-18 |
| Processing Apparatus Fluid-processing A Process Target Body App 20100051068 - Miyanari; Atsushi | 2010-03-04 |
| Liquid Solvent Abutment Unit App 20100024853 - Nakamura; Akihiko ; et al. | 2010-02-04 |
| Method of Thinning Wafer and Support plate App 20090325467 - Nakamura; Akihiko ; et al. | 2009-12-31 |
| Support plate, carrier device, releasing device, and releasing method App 20090305617 - Nakamura; Akihiro ; et al. | 2009-12-10 |
| Perforated Support Plate App 20090288780 - Nakamura; Akihiko ; et al. | 2009-11-26 |
| Support plate App 20090197070 - Miyanari; Atsushi | 2009-08-06 |
| Separating Device App 20090139662 - Nakamura; Akihiko ; et al. | 2009-06-04 |
| Adhesive Composition And Adhesive Film App 20090137760 - Misumi; Koichi ; et al. | 2009-05-28 |
| Supporting plate Grant D552,565 - Nakamura , et al. October 9, 2 | 2007-10-09 |
| Substrate attaching method Grant 7,268,061 - Miyanari , et al. September 11, 2 | 2007-09-11 |
| Substrate Supporting Plate App 20070151674 - Miyanari; Atsushi | 2007-07-05 |
| Supporting plate Grant D544,452 - Nakamura , et al. June 12, 2 | 2007-06-12 |
| Stripping device and stripping apparatus App 20070125751 - Nakamura; Akihiko ; et al. | 2007-06-07 |
| Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate App 20070125495 - Nakamura; Akihiko ; et al. | 2007-06-07 |
| Supporting plate, and method for attaching supporting plate App 20070128832 - Nakamura; Akihiko ; et al. | 2007-06-07 |
| Substrate supporting plate and stripping method for supporting plate Grant 7,211,168 - Miyanari May 1, 2 | 2007-05-01 |
| Supporting plate, apparatus, and method for stripping supporting plate App 20070062644 - Nakamura; Akihiko ; et al. | 2007-03-22 |
| Method for thinning substrate and method for manufacturing circuit device App 20070054470 - Nakamura; Akihiko ; et al. | 2007-03-08 |
| Substrate supporting plate and stripping method for supporting plate App 20050173064 - Miyanari, Atsushi | 2005-08-11 |
| Substrate attaching method App 20050170612 - Miyanari, Atsushi ; et al. | 2005-08-04 |
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