Miyakoshi; Takeshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miyakoshi; Takeshi.The latest application filed is for "semiconductor device".
- Miyakoshi; Takeshi - Yokohama JP
- Miyakoshi; Takeshi - Kanagawa JP
- Miyakoshi; Takeshi - Hokkaido JP
- MIYAKOSHI; Takeshi - Kawasaki JP
| Patent | Date |
|---|---|
| Semiconductor device Grant 10,236,231 - Miyakoshi , et al. | 2019-03-19 |
| Semiconductor package Grant 10,134,710 - Miyakoshi , et al. November 20, 2 | 2018-11-20 |
| Semiconductor Device App 20170301599 - MIYAKOSHI; Takeshi ; et al. | 2017-10-19 |
| Semiconductor Package App 20170148766 - MIYAKOSHI; Takeshi ; et al. | 2017-05-25 |
| Semiconductor package Grant 9,635,762 - Watanabe , et al. April 25, 2 | 2017-04-25 |
| Semiconductor package Grant 9,601,450 - Miyakoshi , et al. March 21, 2 | 2017-03-21 |
| Manufacturing method for semiconductor device Grant 9,368,474 - Matsubara , et al. June 14, 2 | 2016-06-14 |
| Heat sink in the aperture of substrate Grant 9,362,200 - Honda , et al. June 7, 2 | 2016-06-07 |
| Manufacturing Method For Semiconductor Device App 20160079204 - Matsubara; Hiroaki ; et al. | 2016-03-17 |
| Semiconductor Package App 20160027715 - WATANABE; Shinji ; et al. | 2016-01-28 |
| Semiconductor Package And Method Of Manufacturing The Same App 20150371934 - HONDA; Hirokazu ; et al. | 2015-12-24 |
| Semiconductor Package App 20150279759 - Miyakoshi; Takeshi ; et al. | 2015-10-01 |
| Semiconductor Device App 20150243576 - MIYAKOSHI; Takeshi ; et al. | 2015-08-27 |
| Method Of Manufacturing Electronic Device And Electronic Device App 20120080219 - TAKEUCHI; Shuichi ; et al. | 2012-04-05 |
| Electronic Device App 20120048607 - TAKAHASHI; Tetsuya ; et al. | 2012-03-01 |
| Wire Bonding Method, Electronic Apparatus, And Method Of Manufacturing Same App 20100126763 - Matsumura; Takayoshi ; et al. | 2010-05-27 |
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