MIYAKE; Toshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for MIYAKE; Toshihiro.The latest application filed is for "electronic device".

Company Profile

1.27.30

MIYAKE; Toshihiro - Kariya-city JP
Miyake; Toshihiro - Kariya JP
Miyake; Toshihiro - Inuyama JP
Miyake; Toshihiro - Inuyama-city JP
MIYAKE; Toshihiro - Inuyama-shi JP
Miyake; Toshihiro - Urayasu JP
Miyake; Toshihiro - Urayasu-shi JP
Miyake, Toshihiro - Fukaya-Si JP
Miyake; Toshihiro - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Device App 20220210942 - MIYAKE; Toshihiro	2022-06-30
Joint Structure, Electronic Device And Method For Manufacturing The Joint Structure App 20220142005 - MIYAKE; TOSHIHIRO ; et al.	2022-05-05
Electronic Device App 20210013121 - MIYAKE; Toshihiro	2021-01-14
Composite material, method for forming the composite material, electrode plated with the composite material, and connection structure having the composite material Grant 9,970,121 - Ochi , et al. May 15, 2	2018-05-15
Electronic apparatus and manufacturing method of electronic apparatus Grant 9,743,531 - Miyake August 22, 2	2017-08-22
Electric connection structure Grant 9,698,506 - Miyake July 4, 2	2017-07-04
Electronic Apparatus And Manufacturing Method Of Electronic Apparatus App 20160380367 - MIYAKE; Toshihiro	2016-12-29
Composite Material, Method For Forming The Composite Material, Electrode Plated With The Composite Material, And Connection Structure Having The Composite Material App 20160201211 - OCHI; Kenji ; et al.	2016-07-14
Electric Connection Structure App 20160141782 - MIYAKE; Toshihiro	2016-05-19
Composite material, electric contact electrode, electric contact film, conductive filler, electric contact structure using composite material, and manufacturing method of composite material Grant 9,305,676 - Miyake April 5, 2	2016-04-05
Press-fit pin, connection structure including the press-fit pin, and electronic device including the press-fit pin Grant 9,093,780 - Miyake July 28, 2	2015-07-28
Press-fit Pin, Connection Structure Including The Press-fit Pin, And Electronic Device Including The Press-fit Pin App 20140213080 - Miyake; Toshihiro	2014-07-31
Composite Material, Electric Contact Electrode, Electric Contact Film, Conductive Filler, Electric Contact Structure Using Composite Material, And Manufacturing Method Of Composite Material App 20130081855 - Miyake; Toshihiro	2013-04-04
Card edge connector and method of manufacturing the same Grant 8,187,038 - Kamiya , et al. May 29, 2	2012-05-29
Card edge connector and method for assembling the same Grant 7,931,502 - Iida , et al. April 26, 2	2011-04-26
Electrical Connector Assembly For Connecting Printed Circuit Board And Electrical Component, And Electric Device App 20110059661 - INOMATA; Noriyasu ; et al.	2011-03-10
Card edge connector and method for assembling the same App 20110021078 - Iida; Taku ; et al.	2011-01-27
Card edge connector and method of manufacturing the same App 20110021080 - Kamiya; Takashi ; et al.	2011-01-27
Card edge connector and method of manufacturing the same Grant 7,748,988 - Hori , et al. July 6, 2	2010-07-06
Card edge connector and method of manufacturing the same Grant 7,628,654 - Hori , et al. December 8, 2	2009-12-08
Card edge connector and method of manufacturing the same App 20090191764 - Hori; Masashi ; et al.	2009-07-30
Card edge connector and method of manufacturing the same App 20090191760 - Hori; Masashi ; et al.	2009-07-30
Metal bonding method Grant 7,481,353 - Miyake January 27, 2	2009-01-27
Exposure apparatus and device manufacturing method Grant 7,433,019 - Kiuchi , et al. October 7, 2	2008-10-07
Circuit board and circuit board connection structure Grant 7,417,195 - Totani , et al. August 26, 2	2008-08-26
Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board Grant 7,286,367 - Miyake , et al. October 23, 2	2007-10-23
Method for manufacturing printed wiring board with embedded electric device Grant 7,165,321 - Kondo , et al. January 23, 2	2007-01-23
Exposure apparatus and device manufacturing method App 20060209278 - Kiuchi; Tohru ; et al.	2006-09-21
Method for connecting printed circuit boards and connected printed circuit boards Grant 7,080,445 - Miyake , et al. July 25, 2	2006-07-25
Metal bonding method App 20060027633 - Miyake; Toshihiro	2006-02-09
Connecting structure of printed circuit boards Grant 6,966,482 - Totani , et al. November 22, 2	2005-11-22
Interconnection structure for interconnecting printed circuit boards Grant 6,784,375 - Miyake , et al. August 31, 2	2004-08-31
Circuit board and circuit board connection structure App 20040156583 - Totani, Makoto ; et al.	2004-08-12
Method of connecting circuit boards Grant 6,769,598 - Miyake , et al. August 3, 2	2004-08-03
Method for manufacturing printed wiring board with embedded electric device App 20040091687 - Kondo, Koji ; et al.	2004-05-13
Method of connecting circuit boards Grant 6,719,187 - Miyake , et al. April 13, 2	2004-04-13
Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device Grant 6,680,441 - Kondo , et al. January 20, 2	2004-01-20
Connection structure and connection method of for connecting two circuit boards Grant 6,657,137 - Miyake , et al. December 2, 2	2003-12-02
Method of connecting circuit boards App 20030213831 - Miyake, Toshihiro ; et al.	2003-11-20
Method of connecting circuit boards App 20030205610 - Miyake, Toshihiro ; et al.	2003-11-06
Bonding method and bonding structure of thermoplastic resin material Grant 6,605,357 - Miyake , et al. August 12, 2	2003-08-12
Method of connecting circuit boards Grant 6,601,754 - Miyake , et al. August 5, 2	2003-08-05
Method of connecting circuit boards Grant 6,598,780 - Miyake , et al. July 29, 2	2003-07-29
Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit board App 20030133275 - Miyake, Toshihiro ; et al.	2003-07-17
Connecting structure of printed circuit boards App 20030098339 - Totani, Makoto ; et al.	2003-05-29
Method for connecting printed circuit boards and connected printed circuit boards App 20030079341 - Miyake, Toshihiro ; et al.	2003-05-01
Exposure apparatus, exposure method, method of adjusting pressure of projection optical system and method of assembling exposure apparatus App 20030020888 - Tanaka, Yasuaki ; et al.	2003-01-30
Method of manufacturing three-dimensional printed wiring board Grant 6,499,217 - Yamada , et al. December 31, 2	2002-12-31
Method for interconnecting printed circuit boards and interconnection structure App 20020189862 - Miyake, Toshihiro ; et al.	2002-12-19
Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device App 20020192442 - Kondo, Koji ; et al.	2002-12-19
Method for interconnecting printed circuit boards and interconnection structure Grant 6,449,836 - Miyake , et al. September 17, 2	2002-09-17
Connection structure and connection method of both circuit boards App 20020022385 - Miyake, Toshihiro ; et al.	2002-02-21
Connecting method and connecting structure of printed circuit boards App 20020014518 - Totani, Makoto ; et al.	2002-02-07
Method of connecting circuit boards App 20010042780 - Miyake, Toshihiro ; et al.	2001-11-22
Soldered product App 20010023028 - Miyake, Toshihiro ; et al.	2001-09-20
Method of connecting circuit boards App 20010013535 - Miyake, Toshihiro ; et al.	2001-08-16
Process of joining metal members Grant 5,511,719 - Miyake , et al. April 30, 1	1996-04-30

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