Miyake; Sumiya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyake; Sumiya.The latest application filed is for "decomposition reaction apparatus, system for producing raw material for recycled resin composition, method for producing raw material for recycled resin composition, raw material for recycled resin composition, and formed article".

Company Profile

0.5.5

Miyake; Sumiya - Tokyo JP
Miyake; Sumiya - Yokohama JP
Miyake, Sumiya - Yokohama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Decomposition reaction apparatus, system for producing raw material for recycled resin composition, method for producing raw material for recycled resin composition, raw material for recycled resin composition, and formed article Grant 8,188,154 - Goto , et al. May 29, 2	2012-05-29
Decomposition Reaction Apparatus, System For Producing Raw Material For Recycled Resin Composition, Method For Producing Raw Material For Recycled Resin Composition, Raw Material For Recycled Resin Composition, And Formed Article App 20090215912 - Goto; Junya ; et al.	2009-08-27
Latent catalyst Grant 6,946,421 - Miyake , et al. September 20, 2	2005-09-20
Thermosetting resin and tetraorganophosphonium dicyclic tetraorganoborane catalyst Grant 6,881,812 - Miyake , et al. April 19, 2	2005-04-19
Latent catalyst App 20040034125 - Miyake, Sumiya ; et al.	2004-02-19
Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product Grant 6,664,344 - Oki , et al. December 16, 2	2003-12-16
Thermosetting resin composition, epoxy resin molding material and semiconductor device respectively using latent catalyst App 20030199391 - Miyake, Sumiya ; et al.	2003-10-23
Latent catalyst, thermosetting resin composition comprising the catalyst, epoxy resin molding material comprising the catalyst, and semiconductor device App 20010037003 - Miyake, Sumiya ; et al.	2001-11-01
Semiconductor device encapsulated with epoxy resin composition comprising latent catalyst App 20010021454 - Miyake, Sumiya ; et al.	2001-09-13
Thermoplastic elastomer composition Grant 5,597,867 - Tsujimoto , et al. January 28, 1	1997-01-28

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