loadpatents
name:-0.017880916595459
name:-0.023490905761719
name:-0.0029749870300293
Miyake; Hidetaka Patent Filings

Miyake; Hidetaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyake; Hidetaka.The latest application filed is for "wire electrical discharge machining apparatus and method of manufacturing semiconductor wafer".

Company Profile
2.27.22
  • Miyake; Hidetaka - Tokyo JP
  • Miyake; Hidetaka - Chiyoda-ku N/A JP
  • Miyake; Hidetaka - Nakai-machi JP
  • Miyake; Hidetaka - Amagasaki JP
  • Miyake; Hidetaka - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wire electrical discharge machining apparatus and method of manufacturing semiconductor wafer
Grant 10,300,542 - Miyake , et al.
2019-05-28
Wire electric discharge machining apparatus and manufacturing method for thin plate and manufacturing method for semiconductor wafer using wire electric discharge machining apparatus
Grant 10,220,459 - Miyake , et al.
2019-03-05
Wire Electrical Discharge Machining Apparatus And Method Of Manufacturing Semiconductor Wafer
App 20180229320 - MIYAKE; Hidetaka ;   et al.
2018-08-16
Wire electric discharge machining apparatus
Grant 9,950,379 - Miyake , et al. April 24, 2
2018-04-24
Workpiece retainer, wire electric discharge machining device, thin-plate manufacturing method, and semiconductor-wafer manufacturing method
Grant 9,833,854 - Yuzawa , et al. December 5, 2
2017-12-05
Wire electric-discharge machining device, wire electric-discharge machining method, thin-plate manufacturing method, and semiconductor wafer manufacturing method
Grant 9,707,638 - Itokazu , et al. July 18, 2
2017-07-18
Wire discharge-machining apparatus with parallel cutting wires
Grant 9,643,270 - Miyake , et al. May 9, 2
2017-05-09
Wire-cut electrical discharge machining apparatus and semiconductor wafer manufacturing method
Grant 9,387,548 - Miyake , et al. July 12, 2
2016-07-12
Wire Electric Discharge Machining Apparatus And Manufacturing Method For Thin Plate And Manufacturing Method For Semiconductor Wafer Using Wire Electric Discharge Machining Apparatus
App 20160059338 - MIYAKE; Hidetaka ;   et al.
2016-03-03
Wire Discharge-machining Apparatus With Parallel Cutting Wires
App 20150231719 - MIYAKE; Hidetaka ;   et al.
2015-08-20
Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method
Grant 9,089,916 - Itokazu , et al. July 28, 2
2015-07-28
Wire discharge-machining apparatus with parallel cutting wires
Grant 9,050,672 - Miyake , et al. June 9, 2
2015-06-09
Wire Discharge Machining Apparatus And Manufacturing Method For Semiconductor Wafers Using The Same
App 20150053650 - Miyake; Hidetaka ;   et al.
2015-02-26
Wire Electric-discharge Machining Device, Wire Electric-discharge Machining Method, Thin-plate Manufacturing Method, And Semiconductor Wafer Manufacturing Method
App 20140332503 - Itokazu; Atsushi ;   et al.
2014-11-13
Wire electric discharge machine and wire electric discharge machining method
Grant 8,829,383 - Onodera , et al. September 9, 2
2014-09-09
Electrical discharge machine
Grant 8,664,559 - Miyake , et al. March 4, 2
2014-03-04
Wire-cut Electrical Discharge Machining Apparatus And Semiconductor Wafer Manufacturing Method
App 20130240487 - Miyake; Hidetaka ;   et al.
2013-09-19
Wire Electric Discharge Machining Apparatus, Wire Electric Discharge Machining Method, Thin Plate Manufacturing Method, And Semiconductor Wafer Manufacturing Method
App 20130140277 - Itokazu; Atsushi ;   et al.
2013-06-06
Workpiece Retainer, Wire Electric Discharge Machining Device, Thin-plate Manufacturing Method, And Semiconductor-wafer Manufacturing Method
App 20130043217 - Yuzawa; Takashi ;   et al.
2013-02-21
Electrical Discharge Machining Apparatus And Electrical Discharge Machining Method
App 20120312787 - Nakagawa; Takayuki ;   et al.
2012-12-13
Wire Electric Discharge Machining Apparatus, Wire Electric Discharge Machining Method, Thin Board Manufacturing Method, And Semiconductor Wafer Manufacturing Method
App 20120217224 - Miyake; Hidetaka ;   et al.
2012-08-30
Wire Electric Discharge Machine And Wire Electric Discharge Machining Method
App 20110100959 - Onodera; Yasuo ;   et al.
2011-05-05
Wire Discharge-machining Apparatus And Wire Discharge-machining Method, Semiconductor Wafer Manufacturing Apparatus And Semiconductor Wafer Manufacturing Method, And Solar-cell Wafer Manufacturing Apparatus And Solar-cell Wafer Manufacturing Method
App 20110092053 - Miyake; Hidetaka ;   et al.
2011-04-21
Electric discharge machining apparatus
Grant 7,518,081 - Miyake , et al. April 14, 2
2009-04-14
Electrical Discharge Machine
App 20080197115 - Miyake; Hidetaka ;   et al.
2008-08-21
Electric discharge machining apparatus
App 20070102402 - Miyake; Hidetaka ;   et al.
2007-05-10
Electric discharge machining apparatus
Grant 6,881,918 - Miyake , et al. April 19, 2
2005-04-19
Electric Discharge Machining Apparatus
App 20050016965 - Miyake, Hidetaka ;   et al.
2005-01-27
Electric discharge machining device and electric discharge machining method
Grant 6,788,019 - Imai , et al. September 7, 2
2004-09-07
Wire electric discharge machine with stored discharge energy threshold function
Grant 6,781,080 - Sato , et al. August 24, 2
2004-08-24
Information retrieval apparatus and computer-readable recording medium having information retrieval program recorded therein
Grant 6,622,139 - Nakayama , et al. September 16, 2
2003-09-16
Electrical discharge machining apparatus
Grant 6,621,033 - Sato , et al. September 16, 2
2003-09-16
Electric discharge machine
Grant 6,614,234 - Imai , et al. September 2, 2
2003-09-02
Electric discharge machining device and electric discharge machining method
App 20030080094 - Imai, Yoshihito ;   et al.
2003-05-01
Electrical discharge machining apparatus
App 20010050270 - Sato, Tatsushi ;   et al.
2001-12-13
Image processing device employing coding with edge information preserved
Grant 5,524,067 - Miyake , et al. June 4, 1
1996-06-04

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