Miyake; Hideharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyake; Hideharu.The latest application filed is for "semiconductor device having a liquid cooling module".

Company Profile

0.8.8

Miyake; Hideharu - Tokyo JP
Miyake; Hideharu - Chuo-ku N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having a liquid cooling module Grant 8,937,390 - Hisano , et al. January 20, 2	2015-01-20
Semiconductor Device Having A Liquid Cooling Module App 20140183730 - HISANO; Nae ; et al.	2014-07-03
Semiconductor device having a liquid cooling module Grant 8,704,352 - Hisano , et al. April 22, 2	2014-04-22
Wafer Or Circuit Board And Joining Structure Of Wafer Or Circuit Board App 20130140067 - Ishino; Masakazu ; et al.	2013-06-06
Wafer of circuit board and joining structure of wafer or circuit board Grant 8,334,465 - Ishino , et al. December 18, 2	2012-12-18
Semiconductor Device Having A Liquid Cooling Module App 20100171213 - HISANO; Nae ; et al.	2010-07-08
Field Effect Transistor For Preventing Collapse Or Deformation Of Active Regions App 20100072552 - SUNAMI; Hideo ; et al.	2010-03-25
Semiconductor chip with a porous single crystal layer and manufacturing method of the same Grant 7,632,696 - Oyu , et al. December 15, 2	2009-12-15
Semiconductor Apparatus App 20090134498 - IKEDA; Hiroaki ; et al.	2009-05-28
Wafer of circuit board and joining structure of wafer or circuit board App 20090109641 - Ishino; Masakazu ; et al.	2009-04-30
Semiconductor chip with a porous single crystal layer and manufacturing method of the same App 20060249075 - Oyu; Kiyonori ; et al.	2006-11-09
Method for fabricating a semiconductor memory device having stacked capacitors Grant 5,403,766 - Miyake April 4, 1	1995-04-04
Intermittent etching process Grant 4,790,903 - Sugano , et al. December 13, 1	1988-12-13

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