MIYAKAWA; Takuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for MIYAKAWA; Takuya.The latest application filed is for "magnetic powder, method for producing magnetic powder, powder magnetic core, and coil part".

Company Profile

2.25.33

MIYAKAWA; Takuya - Matsumoto-shi JP
Miyakawa; Takuya - Matsumoto JP
MIYAKAWA; Takuya - Okaya JP
Miyakawa; Takuya - Nagano-ken JP
Miyakawa; Takuya - Suwa JP
Miyakawa, Takuya - Okaya city JP
Miyakawa, Takuya - Suwa-shi JP
Miyakawa, Takuya - Shizuoka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Magnetic Powder, Method For Producing Magnetic Powder, Powder Magnetic Core, And Coil Part App 20210027940 - TADAI; Momo ; et al.	2021-01-28
Medium transport device, printing apparatus, and method for manufacturing medium transport device Grant 10,865,062 - Miyakawa December 15, 2	2020-12-15
Method for forming pattern, method for manufacturing ornament, method for manufacturing belt for wristwatch, method for manufacturing structure for mounting wiring, method for manufacturing semiconductor device, and method for manufacturing printed circuit Grant 10,604,859 - Miyakawa	2020-03-31
Medium Transport Device, Printing Apparatus, And Method For Manufacturing Medium Transport Device App 20190299666 - MIYAKAWA; Takuya	2019-10-03
Nozzle plate, liquid ejecting head, liquid ejecting apparatus, and method of manufacturing nozzle plate Grant 10,399,340 - Saiba , et al. Sep	2019-09-03
Atomic cell, atomic cell manufacturing method, quantum interference device, atomic oscillator, electronic apparatus, and vehicle Grant 10,396,809 - Hayashi , et al. A	2019-08-27
Electro-optical device and electronic apparatus Grant 10,353,248 - Shinohara , et al. July 16, 2	2019-07-16
Nozzle Plate, Liquid Ejecting Head, Liquid Ejecting Apparatus, And Method Of Manufacturing Nozzle Plate App 20180339517 - SAIBA; Takashi ; et al.	2018-11-29
Electro-optical Device And Electronic Apparatus App 20180246357 - Shinohara; Takashi ; et al.	2018-08-30
Quantum Interference Device, Atomic Oscillator, And Electronic Apparatus App 20180241407 - HAYASHI; Nobuhito ; et al.	2018-08-23
Quantum Interference Device, Atomic Oscillator, And Electronic Apparatus App 20180241408 - HAYASHI; Nobuhito ; et al.	2018-08-23
Electro-optical device and electronic apparatus Grant 9,989,810 - Shinohara , et al. June 5, 2	2018-06-05
Method For Forming Pattern, Method For Manufacturing Ornament, Method For Manufacturing Belt For Wristwatch, Method For Manufacturing Structure For Mounting Wiring, Method For Manufacturing Semiconductor Device, And Method For Manufacturing Printed Circuit Board App 20180087169 - MIYAKAWA; Takuya	2018-03-29
Atomic Cell, Atomic Cell Manufacturing Method, Quantum Interference Device, Atomic Oscillator, Electronic Apparatus, And Vehicle App 20170244419 - HAYASHI; Nobuhito ; et al.	2017-08-24
Electro-optical Device And Electronic Apparatus App 20170010491 - Shinohara; Takashi ; et al.	2017-01-12
Ink jet printer and printing method Grant 9,475,312 - Kitada , et al. October 25, 2	2016-10-25
Electro-optical device and electronic apparatus Grant 9,470,932 - Shinohara , et al. October 18, 2	2016-10-18
Electro-optical Device And Electronic Apparatus App 20160004109 - Shinohara; Takashi ; et al.	2016-01-07
Ink jet printer and control method thereof Grant 9,216,593 - Kitada , et al. December 22, 2	2015-12-22
Ink jet printer Grant 9,205,678 - Kitada , et al. December 8, 2	2015-12-08
Ink Jet Printer App 20150290952 - KITADA; Kenji ; et al.	2015-10-15
Ink Jet Printer And Control Method Thereof App 20150273873 - KITADA; Kenji ; et al.	2015-10-01
Ink Jet Printer And Printing Method App 20150202894 - KITADA; Kenji ; et al.	2015-07-23
Manufacturing Apparatus For Oriented Film, Manufacturing Method For Oriented Film, Liquid Crystal Device, And Electronic Device App 20100128212 - NAKATA; Hideo ; et al.	2010-05-27
Oriented-film formation apparatus and oriented film App 20080221346 - Miyakawa; Takuya	2008-09-11
Head member, method for ink-repellent treatment and apparatus for the same Grant 7,344,221 - Miyakawa , et al. March 18, 2	2008-03-18
Coating apparatus and coating method using the same Grant 7,332,034 - Miyakawa , et al. February 19, 2	2008-02-19
Head member, method for ink-repellent treatment and apparatus for the same Grant 7,291,281 - Miyakawa , et al. November 6, 2	2007-11-06
Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment Grant 7,238,615 - Miyakawa July 3, 2	2007-07-03
Manufacturing apparatus for oriented film, liquid crystal device, and electronic device App 20070015070 - Nakata; Hideo ; et al.	2007-01-18
Manufacturing apparatus for oriented film, manufacturing method for oriented film, liquid crystal device, and electronic device App 20070014937 - Nakata; Hideo ; et al.	2007-01-18
Method for forming a transparent electrode film Grant 7,163,638 - Miyakawa January 16, 2	2007-01-16
Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method Grant 7,148,148 - Mori , et al. December 12, 2	2006-12-12
Method of forming a film of predetermined pattern on a surface as well as device manufactured by employing the same, and method of manufacturing device Grant 7,098,121 - Mori , et al. August 29, 2	2006-08-29
Coaoting apparatus and coating method using the same App 20050191420 - Miyakawa, Takuya ; et al.	2005-09-01
Head member, method for ink-repellent treatment and apparatus for the same App 20050168530 - Miyakawa, Takuya ; et al.	2005-08-04
Head member, method for ink-repellent treatment and apparatus for the same App 20050168529 - Miyakawa, Takuya ; et al.	2005-08-04
Head member, method for ink-repellent treatment and apparatus for the same App 20050168528 - Miyakawa, Takuya ; et al.	2005-08-04
Head member, method for ink-repellent treatment and apparatus for the same App 20050168527 - Miyakawa, Takuya ; et al.	2005-08-04
Head member ink repellence treating method and treating device Grant 6,923,525 - Miyakawa , et al. August 2, 2	2005-08-02
Method for forming a transparent electrode film App 20050040135 - Miyakawa, Takuya	2005-02-24
Method of forming pattern of transparent conductive film App 20050003090 - Miyakawa, Takuya	2005-01-06
Pattern forming method and apparatus used for semiconductor device, electric circuit, display module, and light emitting device App 20040209190 - Mori, Yoshiaki ; et al.	2004-10-21
Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment App 20040203235 - Miyakawa, Takuya	2004-10-14
Method and apparatus for forming porous insulating layer and electronic device manufactured using the method App 20040161539 - Miyakawa, Takuya	2004-08-19
Film formation method as well as device manufactured by employing the same, and method of manufacturing device App 20040082163 - Mori, Yoshiaki ; et al.	2004-04-29
Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent Grant 6,620,282 - Mori , et al. September 16, 2	2003-09-16
Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent Grant 6,604,672 - Mori , et al. August 12, 2	2003-08-12
Mask forming and removing method, and a semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method App 20030143845 - Mori, Yoshiaki ; et al.	2003-07-31
Head member ink repellence treating method and treating device App 20020135636 - Miyakawa, Takuya ; et al.	2002-09-26
Carbide dispersed, strengthened copper alloy App 20020007878 - Choh, Takao ; et al.	2002-01-24
Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent App 20010052390 - Mori, Yoshiaki ; et al.	2001-12-20
Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent App 20010009176 - Mori, Yoshiaki ; et al.	2001-07-26
Method and apparatus for solid bonding, a conductor bonding method, a packaging method, and a bonding agent and a method for manufacturing a bonding agent Grant 6,221,197 - Mori , et al. April 24, 2	2001-04-24
Surface treatment apparatus Grant 6,086,710 - Miyashita , et al. July 11, 2	2000-07-11
Surface treatment method Grant 6,006,763 - Mori , et al. December 28, 1	1999-12-28
Method of making a piezoelectric element Grant 5,918,354 - Ikegami , et al. July 6, 1	1999-07-06
Method and apparatus for bonding using brazing material Grant 5,735,451 - Mori , et al. April 7, 1	1998-04-07

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