Miyakawa; Masafumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyakawa; Masafumi.The latest application filed is for "surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same".

Company Profile

0.3.5

Miyakawa; Masafumi - Nagoya JP
Miyakawa, Masafumi - Nagoya-shi JP
Miyakawa, Masafumi - Nagoya-shi Aichi JP
Miyakawa, Masafumi - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer Grant 7,501,312 - Koshimizu , et al. March 10, 2	2009-03-10
Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film Grant 7,238,421 - Saimoto , et al. July 3, 2	2007-07-03
Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film Grant 7,201,969 - Miyakawa , et al. April 10, 2	2007-04-10
Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same App 20050244631 - Sugimoto, Kosuke ; et al.	2005-11-03
Pressure-sensitive adhesive film for the suface protection of semiconductor wafers and method for protection of semiconductor wafers with the film App 20050203250 - Miyakawa, Masafumi ; et al.	2005-09-15
Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film App 20050161774 - Saimoto, Yoshihisa ; et al.	2005-07-28
Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer App 20050164509 - Koshimizu, Takanobu ; et al.	2005-07-28
Surface protecting adhesive film for semiconductor wafer and protecting method for semiconductor wafer using said adhesive film App 20030064579 - Miyakawa, Masafumi ; et al.	2003-04-03

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