Miyakawa; Kuniko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miyakawa; Kuniko.The latest application filed is for "c49-structured tungsten-containing titanium salicide structure and method of forming the same".
- Miyakawa; Kuniko - Tokyo JP
| Patent | Date |
|---|---|
| C49-structured tungsten-containing titanium salicide structure and method of forming the same Grant 6,114,765 - Fujii , et al. September 5, 2 | 2000-09-05 |
| Method of burying a contact hole with a metal for forming multilevel interconnections Grant 5,990,005 - Hirose , et al. November 23, 1 | 1999-11-23 |
| Method of manufacturing semiconductor device Grant 5,869,397 - Miyakawa February 9, 1 | 1999-02-09 |
| Eutectic Cu-alloy wiring structure in a semiconductor device Grant 5,686,760 - Miyakawa November 11, 1 | 1997-11-11 |
| Process of manufacturing a semiconductor device by filling a via hole in an interlayered film of the device with wiring metal Grant 5,543,357 - Yamada , et al. August 6, 1 | 1996-08-06 |
| Method of filling contact holes of a semiconductor device Grant 5,169,803 - Miyakawa December 8, 1 | 1992-12-08 |
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