Miyajima; Hisakazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miyajima; Hisakazu.The latest application filed is for "wafer level package structure, and sensor device obtained from the same package structure".
- Miyajima; Hisakazu - Osaka JP
- Miyajima; Hisakazu - Osaka-shi JP
| Patent | Date |
|---|---|
| Capacitive sensor Grant 8,176,782 - Furukubo , et al. May 15, 2 | 2012-05-15 |
| Wafer level package structure and production method therefor Grant 8,080,869 - Okudo , et al. December 20, 2 | 2011-12-20 |
| Wafer level package structure, and sensor device obtained from the same package structure Grant 8,067,769 - Okudo , et al. November 29, 2 | 2011-11-29 |
| Sensor device and production method therefor Grant 8,026,594 - Okudo , et al. September 27, 2 | 2011-09-27 |
| Sensor device and production method therefor Grant 7,674,638 - Okudo , et al. March 9, 2 | 2010-03-09 |
| Capacitive Sensor App 20090266164 - Furukubo; Eiichi ; et al. | 2009-10-29 |
| Wafer Level Package Structure, And Sensor Device Obtained From The Same Package Structure App 20090267165 - Okudo; Takafumi ; et al. | 2009-10-29 |
| Sensor Device And Production Method Therefor App 20090236678 - Okudo; Takafumi ; et al. | 2009-09-24 |
| Capacitive sensor Grant 7,554,340 - Furukubo , et al. June 30, 2 | 2009-06-30 |
| Wafer Level Package Structure And Production Method Therefor App 20090159997 - Okudo; Takafumi ; et al. | 2009-06-25 |
| Sensor Device And Production Method Therefor App 20090152656 - Okudo; Takafumi ; et al. | 2009-06-18 |
| Capacitive Sensor App 20070273393 - Furukubo; Eiichi ; et al. | 2007-11-29 |
| Semiconductor acceleration sensor and method of manufacturing the same Grant 7,107,847 - Yoshida , et al. September 19, 2 | 2006-09-19 |
| Mechanical deformation amount sensor Grant 6,848,320 - Miyajima , et al. February 1, 2 | 2005-02-01 |
| Semiconductor acceleration sensor and method of manufacturing the same App 20040261529 - Yoshida, Hitoshi ; et al. | 2004-12-30 |
| Mechanical deformation amount sensor App 20040012062 - Miyajima, Hisakazu ; et al. | 2004-01-22 |
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