loadpatents
name:-0.0093700885772705
name:-0.13179516792297
name:-0.00148606300354
Miyajima; Fumio Patent Filings

Miyajima; Fumio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyajima; Fumio.The latest application filed is for "resin molding machine and method of resin molding".

Company Profile
0.14.6
  • Miyajima; Fumio - Chikuma JP
  • Miyajima; Fumio - Chikuma-shi JP
  • Miyajima; Fumio - Nagano JP
  • Miyajima; Fumio - Togura-machi JP
  • Miyajima; Fumio - Togura JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resin molding machine and method of resin molding
Grant 7,909,596 - Miyajima , et al. March 22, 2
2011-03-22
Resin molding equipment and resin molding method
Grant 7,407,608 - Miyajima , et al. August 5, 2
2008-08-05
Resin molding machine and method of resin molding
App 20080116598 - Miyajima; Fumio ;   et al.
2008-05-22
Imprinting method and nano-imprinting apparatus
App 20070262049 - Miyajima; Fumio ;   et al.
2007-11-15
Resin molding equipment and resin molding method
App 20060093692 - Miyajima; Fumio ;   et al.
2006-05-04
Method of resin molding
Grant 6,770,236 - Miyajima August 3, 2
2004-08-03
Resin molding machine and method of resin molding
Grant 6,743,389 - Miyajima , et al. June 1, 2
2004-06-01
Resin molding machine
Grant 6,478,562 - Miyajima November 12, 2
2002-11-12
Apparatus for sealing a semiconductor device utilizing a release film
Grant 6,459,159 - Miyagawa , et al. October 1, 2
2002-10-01
Method of resin molding
Grant 6,444,157 - Miyajima September 3, 2
2002-09-03
Method of resin molding and resin molding machine
App 20020025352 - Miyajima, Fumio
2002-02-28
Resin sealing method and resin sealing apparatus
App 20020017738 - Miyajima, Fumio
2002-02-14
Resin molding machine and method of resin molding
App 20020015748 - Miyajima, Fumio ;   et al.
2002-02-07
Resin sealing method for a semiconductor device
Grant 6,261,501 - Miyagawa , et al. July 17, 2
2001-07-17
Method of resin molding
Grant 6,187,243 - Miyajima February 13, 2
2001-02-13
Resin sealing method for chip-size packages
Grant 6,048,483 - Miyajima April 11, 2
2000-04-11
Method of operating a molding machine with release film
Grant 5,891,384 - Miyajima April 6, 1
1999-04-06
Automatic molding machine using release film
Grant 5,891,483 - Miyajima April 6, 1
1999-04-06
Method of resin molding and resin molding machine for the same
Grant 5,824,252 - Miyajima October 20, 1
1998-10-20
Resin molding machine
Grant 5,800,841 - Miyajima September 1, 1
1998-09-01

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