Miyai; Toshiki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miyai; Toshiki.The latest application filed is for "wafer processing method".
Company Profile
53.34.41
- Miyai; Toshiki - Tokyo JP
- Miyai; Toshiki - Ota-ku JP
Patent Activity
| Patent | Date |
|---|---|
| Wafer processing method Grant 11,393,721 - Harada , et al. July 19, 2 | 2022-07-19 |
| Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer Grant 11,380,587 - Harada , et al. July 5, 2 | 2022-07-05 |
| Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer Grant 11,380,588 - Harada , et al. July 5, 2 | 2022-07-05 |
| Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer Grant 11,361,997 - Harada , et al. June 14, 2 | 2022-06-14 |
| Wafer processing method Grant 11,322,406 - Harada , et al. May 3, 2 | 2022-05-03 |
| Wafer processing method including applying a polyester sheet to a wafer Grant 11,322,407 - Harada , et al. May 3, 2 | 2022-05-03 |
| Wafer processing method Grant 11,302,578 - Harada , et al. April 12, 2 | 2022-04-12 |
| Wafer processing method Grant 11,289,379 - Harada , et al. March 29, 2 | 2022-03-29 |
| Wafer processing method Grant 11,270,916 - Harada , et al. March 8, 2 | 2022-03-08 |
| Wafer processing method Grant 11,251,082 - Harada , et al. February 15, 2 | 2022-02-15 |
| Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet Grant 11,127,633 - Harada , et al. September 21, 2 | 2021-09-21 |
| Wafer processing method including applying a polyester sheet to a wafer Grant 11,069,574 - Harada , et al. July 20, 2 | 2021-07-20 |
| Wafer processing method Grant 11,062,948 - Harada , et al. July 13, 2 | 2021-07-13 |
| Wafer processing method using a ring frame and a polyester sheet Grant 11,056,334 - Harada , et al. July 6, 2 | 2021-07-06 |
| Wafer processing method including applying a polyester sheet to a wafer Grant 11,049,757 - Harada , et al. June 29, 2 | 2021-06-29 |
| Wafer processing method including applying a polyester sheet to a wafer Grant 11,049,772 - Harada , et al. June 29, 2 | 2021-06-29 |
| Wafer processing method Grant 11,043,421 - Harada , et al. June 22, 2 | 2021-06-22 |
| Wafer processing method Grant 11,037,813 - Harada , et al. June 15, 2 | 2021-06-15 |
| Wafer processing method using a ring frame with a polyester sheet with no adhesive layer Grant 11,037,814 - Harada , et al. June 15, 2 | 2021-06-15 |
| Wafer processing method including applying a polyolefin sheet to a wafer Grant 11,031,234 - Harada , et al. June 8, 2 | 2021-06-08 |
| Wafer processing method including applying a polyester sheet to a wafer Grant 11,024,543 - Harada , et al. June 1, 2 | 2021-06-01 |
| Wafer processing method using a ring frame and a polyester sheet Grant 11,018,043 - Harada , et al. May 25, 2 | 2021-05-25 |
| Wafer processing method for dividing a wafer along predefined division lines using polyester sheet Grant 11,018,058 - Harada , et al. May 25, 2 | 2021-05-25 |
| Wafer processing method using a ring frame and a polyolefin sheet Grant 11,011,407 - Harada , et al. May 18, 2 | 2021-05-18 |
| Wafer Processing Method App 20210143064 - HARADA; Shigenori ; et al. | 2021-05-13 |
| Wafer Processing Method App 20210143063 - HARADA; Shigenori ; et al. | 2021-05-13 |
| Wafer processing method for dividing a wafer along predefined division lines Grant 11,004,744 - Harada , et al. May 11, 2 | 2021-05-11 |
| Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet Grant 10,998,232 - Harada , et al. May 4, 2 | 2021-05-04 |
| Wafer processing method including applying a polyolefin sheet to a wafer Grant 10,991,624 - Harada , et al. April 27, 2 | 2021-04-27 |
| Wafer processing method including applying a polyester sheet to a wafer Grant 10,991,587 - Harada , et al. April 27, 2 | 2021-04-27 |
| Wafer Processing Method App 20210118737 - HARADA; Shigenori ; et al. | 2021-04-22 |
| Wafer Processing Method App 20210118736 - HARADA; Shigenori ; et al. | 2021-04-22 |
| Wafer processing method for dividing a wafer along division lines Grant 10,985,066 - Harada , et al. April 20, 2 | 2021-04-20 |
| Wafer processing method using a laser beam dividing step Grant 10,985,067 - Harada , et al. April 20, 2 | 2021-04-20 |
| Wafer Processing Method App 20210111073 - HARADA; Shigenori ; et al. | 2021-04-15 |
| Wafer Processing Method App 20210111074 - HARADA; Shigenori ; et al. | 2021-04-15 |
| Wafer Processing Method App 20210074589 - HARADA; Shigenori ; et al. | 2021-03-11 |
| Wafer Processing Method App 20210074588 - HARADA; Shigenori ; et al. | 2021-03-11 |
| Wafer Processing Method App 20210043513 - HARADA; Shigenori ; et al. | 2021-02-11 |
| Wafer Processing Method App 20210043514 - HARADA; Shigenori ; et al. | 2021-02-11 |
| Wafer processing method Grant 10,910,269 - Harada , et al. February 2, 2 | 2021-02-02 |
| Wafer processing method Grant 10,896,850 - Harada , et al. January 19, 2 | 2021-01-19 |
| Wafer Processing Method App 20210013101 - HARADA; Shigenori ; et al. | 2021-01-14 |
| Wafer Processing Method App 20210013100 - HARADA; Shigenori ; et al. | 2021-01-14 |
| Wafer Processing Method App 20200388536 - HARADA; Shigenori ; et al. | 2020-12-10 |
| Wafer Processing Method App 20200388537 - HARADA; Shigenori ; et al. | 2020-12-10 |
| Wafer processing method Grant 10,847,420 - Harada , et al. November 24, 2 | 2020-11-24 |
| Wafer Processing Method App 20200357696 - HARADA; Shigenori ; et al. | 2020-11-12 |
| Wafer Processing Method App 20200357695 - HARADA; Shigenori ; et al. | 2020-11-12 |
| Wafer Processing Method App 20200328118 - HARADA; Shigenori ; et al. | 2020-10-15 |
| Wafer Processing Method App 20200328117 - HARADA; Shigenori ; et al. | 2020-10-15 |
| Wafer Processing Method App 20200286784 - HARADA; Shigenori ; et al. | 2020-09-10 |
| Wafer Processing Method App 20200286785 - HARADA; Shigenori ; et al. | 2020-09-10 |
| Wafer Processing Method App 20200266102 - HARADA; Shigenori ; et al. | 2020-08-20 |
| Wafer Processing Method App 20200266090 - HARADA; Shigenori ; et al. | 2020-08-20 |
| Wafer Processing Method App 20200235010 - HARADA; Shigenori ; et al. | 2020-07-23 |
| Wafer Processing Method App 20200235011 - HARADA; Shigenori ; et al. | 2020-07-23 |
| Wafer processing method Grant 10,720,355 - Harada , et al. | 2020-07-21 |
| Wafer Processing Method App 20200185253 - HARADA; Shigenori ; et al. | 2020-06-11 |
| Processing Method For Wafer App 20200185252 - HARADA; Shigenori ; et al. | 2020-06-11 |
| Wafer Processing Method App 20200144049 - HARADA; Shigenori ; et al. | 2020-05-07 |
| Wafer Processing Method App 20200144048 - HARADA; Shigenori ; et al. | 2020-05-07 |
| Wafer Processing Method App 20200126799 - HARADA; Shigenori ; et al. | 2020-04-23 |
| Wafer Processing Method App 20200126859 - HARADA; Shigenori ; et al. | 2020-04-23 |
| Wafer Processing Method App 20200083104 - HARADA; Shigenori ; et al. | 2020-03-12 |
| Wafer Processing Method App 20200083103 - HARADA; Shigenori ; et al. | 2020-03-12 |
| Wafer Processing Method App 20200043789 - HARADA; Shigenori ; et al. | 2020-02-06 |
| Wafer Processing Method App 20200043772 - HARADA; Shigenori ; et al. | 2020-02-06 |
| Wafer Processing Method App 20200013676 - HARADA; Shigenori ; et al. | 2020-01-09 |
| Wafer Processing Method App 20200013675 - HARADA; Shigenori ; et al. | 2020-01-09 |
| Wafer Processing Method App 20190378758 - HARADA; Shigenori ; et al. | 2019-12-12 |
| Wafer Processing Method App 20190378745 - HARADA; Shigenori ; et al. | 2019-12-12 |
| Wafer Processing Method App 20190348326 - HARADA; Shigenori ; et al. | 2019-11-14 |
| Wafer Processing Method App 20190348327 - HARADA; Shigenori ; et al. | 2019-11-14 |
| Workpiece Processing Method App 20100041317 - Miyai; Toshiki | 2010-02-18 |
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