Miyagawa, Fumio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Miyagawa, Fumio.The latest application filed is for "wiring structure and its manufacturing method".
- Miyagawa, Fumio - Nagano-shi JP
- Miyagawa; Fumio - Nagano JP
- Miyagawa; Fumio - Higashi-sainami Nagano-shi JP
| Patent | Date |
|---|---|
| Wiring structure and its manufacturing method App 20040140549 - Miyagawa, Fumio | 2004-07-22 |
| Housing preform and electronic apparatus using the same App 20040084759 - Miyagawa, Fumio | 2004-05-06 |
| Coaxial line assembly of a package for a high frequency element Grant 5,557,074 - Miyamoto , et al. September 17, 1 | 1996-09-17 |
| Process for making a metal wall of a package used for accommodating electronic elements Grant 5,277,357 - Miyamoto , et al. January 11, 1 | 1994-01-11 |
| Package for superconducting devices Grant 4,980,754 - Kotani , et al. December 25, 1 | 1990-12-25 |
| Package for mounting a semiconductor chip of ultra-high frequency Grant 4,890,155 - Miyagawa , et al. December 26, 1 | 1989-12-26 |
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