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Patent applications and USPTO patent grants for Miwa; Tomonori.The latest application filed is for "etching method and substrate processing apparatus".
Patent | Date |
---|---|
Etching method and substrate processing apparatus Grant 11,264,248 - Kon , et al. March 1, 2 | 2022-03-01 |
Etching Method And Substrate Processing Apparatus App 20200185229 - KON; Yoshimitsu ;   et al. | 2020-06-11 |
Etching method Grant 9,735,021 - Sawataishi , et al. August 15, 2 | 2017-08-15 |
Etching method Grant 9,735,025 - Sawataishi , et al. August 15, 2 | 2017-08-15 |
Etching Method App 20160351406 - Sawataishi; Masayuki ;   et al. | 2016-12-01 |
Etching Method App 20160351407 - Sawataishi; Masayuki ;   et al. | 2016-12-01 |
Method for etching etching target layer Grant 9,418,863 - Hirotsu , et al. August 16, 2 | 2016-08-16 |
Method For Etching Etching Target Layer App 20150332932 - HIROTSU; Shin ;   et al. | 2015-11-19 |
Focus ring and plasma processing apparatus Grant 7,658,816 - Koshiishi , et al. February 9, 2 | 2010-02-09 |
Focus ring and plasma processing apparatus App 20070169891 - Koshiishi; Akira ;   et al. | 2007-07-26 |
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