Miwa; Takao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miwa; Takao.The latest application filed is for "resin-containing sheet, and structure and wiring board using same".

Company Profile

0.33.31

Miwa; Takao - Saitama JP
Miwa; Takao - Hitachinaka JP
Miwa; Takao - Hitachi JP
Miwa; Takao - Hitachi-shi JP
Miwa; Takao - Ibaraki JP
Miwa; Takao - Sagamihara JP
Miwa; Takao - Hitachinaka-shi JP
Miwa; Takao - Sagamihara-shi JP
Miwa; Takao - Machida JP
Miwa, Takao - Machida-Shi JP
Miwa; Takao - Katsuta JP
Miwa; Takao - Yokkaichi JP
Miwa; Takao - Nishinomiya JP
Miwa; Takao - Ashiya JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin-containing sheet, and structure and wiring board using same Grant 10,047,202 - Kakutani , et al. August 14, 2	2018-08-14
Resin-containing Sheet, And Structure And Wiring Board Using Same App 20170313831 - KAKUTANI; Takenori ; et al.	2017-11-02
Hydrated water-absorption polymer containing resin composition, porous body and insulated wire using same, method of making the wire and coaxial cable Grant 8,722,137 - Kato , et al. May 13, 2	2014-05-13
Hydrous Water Absorbent Polymer Dispersed Ultraviolet Curable Resin Composition, Insulated Electric Wire Using The Same, Method For Producing The Wire, And Coaxial Cable App 20120090871 - KATO; Yoshihisa ; et al.	2012-04-19
Hydrous water absorbent polymer-dispersed ultraviolet curable resin composition, porous substance, and insulated wire cable using the same App 20110079416 - Kato; Yoshihisa ; et al.	2011-04-07
Active matrix type liquid crystal display apparatus Grant 7,790,248 - Tomioka , et al. September 7, 2	2010-09-07
Fiber-reinforced composite material, method for manufacturing the same, and applications thereof Grant 7,691,473 - Yano , et al. April 6, 2	2010-04-06
Electronic circuit component Grant 7,586,755 - Satoh , et al. September 8, 2	2009-09-08
Hydrated water-absorption polymer containing resin composition, porous body and insulated wire using same, method of making the wire and coaxial cable App 20090220817 - Kato; Yoshihisa ; et al.	2009-09-03
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate Grant 7,535,106 - Shiono , et al. May 19, 2	2009-05-19
Fiber-reinforced Composite Material, Method For Manufacturing The Same, And Applications Thereof App 20090123726 - YANO; Hiroyuki ; et al.	2009-05-14
Fiber-reinforced composite material, method for manufacturing the same and applications thereof Grant 7,455,901 - Yano , et al. November 25, 2	2008-11-25
Low Dielectric Loss Tangent Resin Composition, Curable Film And Cured Product, Electrical Part Using The Same And Method For Production Thereof App 20080221261 - Amou; Satoru ; et al.	2008-09-11
Electronic Circuit Component App 20080174976 - SATOH; Toshiya ; et al.	2008-07-24
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Grant 7,375,155 - Amou , et al. May 20, 2	2008-05-20
Liquid crystal display apparatus Grant 7,349,049 - Kondo , et al. March 25, 2	2008-03-25
Fluorescence analysis optical multiplexer/demultiplexer, fluorescence analysis optical module, fluorescence analyzer, fluorescence/photothermal conversion spectroscopic analyzer, and fluorescence analysis chip Grant 7,304,734 - Fukuzawa , et al. December 4, 2	2007-12-04
Thin film capacitor and electronic circuit component Grant 7,294,905 - Ogino , et al. November 13, 2	2007-11-13
Active matrix type liquid crystal display apparatus App 20070178250 - Tomioka; Yasushi ; et al.	2007-08-02
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate App 20070114653 - Shiono; Osamu ; et al.	2007-05-24
Active matrix type liquid crystal display apparatus Grant 7,189,439 - Tomioka , et al. March 13, 2	2007-03-13
Glass member and production process thereof App 20070044514 - Naitou; Takashi ; et al.	2007-03-01
Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate Grant 7,183,650 - Shiono , et al. February 27, 2	2007-02-27
Glass member App 20070029925 - Naitou; Takashi ; et al.	2007-02-08
Liquid crystal display apparatus App 20060215094 - Kondo; Katsumi ; et al.	2006-09-28
Fiber-reinforced composite material, method for manufacturing the same and applications thereof App 20060182941 - Yano; Hiroyuki ; et al.	2006-08-17
Glass member App 20060177664 - Naitou; Takashi ; et al.	2006-08-10
Liquid crystal display apparatus Grant 7,088,412 - Kondo , et al. August 8, 2	2006-08-08
Fluorescence analysis optical multiplexer/demultiplexer, fluorescence analysis optical module, fluorescence analyzer, fluorescence/photothermal conversion spectroscopic analyzer, and fluorescence analysis chip App 20060109465 - Fukuzawa; Takashi ; et al.	2006-05-25
Glass member and production process thereof App 20060063006 - Naitou; Takashi ; et al.	2006-03-23
Glass member App 20060063009 - Naitou; Takashi ; et al.	2006-03-23
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof App 20050277753 - Amou, Satoru ; et al.	2005-12-15
Semiconductor connection substrate Grant 6,933,601 - Satoh , et al. August 23, 2	2005-08-23
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Grant 6,930,140 - Amou , et al. August 16, 2	2005-08-16
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Grant 6,878,448 - Ishii , et al. April 12, 2	2005-04-12
Method Of Manufacturing Glass Substrate For Information Recording Media, Glass Substrate For Information Recording Media Manufactured Using The Method, And Information Recording Medium Using The Glass Substrate Grant 6,845,635 - Watanabe , et al. January 25, 2	2005-01-25
Electronic circuit component App 20040246692 - Satoh, Toshiya ; et al.	2004-12-09
Semiconductor connection substrate App 20040238941 - Satoh, Toshiya ; et al.	2004-12-02
Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor App 20040217455 - Shiono, Osamu ; et al.	2004-11-04
Thin film capacitor and electronic circuit component App 20040195567 - Ogino, Masahiko ; et al.	2004-10-07
Active matrix type liquid crystal display apparatus App 20040170777 - Tomioke, Yasushi ; et al.	2004-09-02
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Grant 6,756,441 - Amou , et al. June 29, 2	2004-06-29
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof App 20040048965 - Amou, Satoru ; et al.	2004-03-11
Active matrix type liquid crystal display apparatus Grant 6,682,783 - Tomioka , et al. January 27, 2	2004-01-27
Semiconductor apparatus having stress cushioning layer Grant 6,621,154 - Satoh , et al. September 16, 2	2003-09-16
Liquid crystal display apparatus App 20030133064 - Kondo, Katsumi ; et al.	2003-07-17
Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof App 20020161091 - Amou, Satoru ; et al.	2002-10-31
Electric circuit board including glass substrate and method and apparatus trimming thereof App 20020153165 - Kojima, Yasuyuki ; et al.	2002-10-24
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same App 20020146565 - Ishll, Toshiaki ; et al.	2002-10-10
Method of manufacturing glass substrate for information recording media, glass substrate for information recording media manufactured using the method, and information recording medium using the glass substrate App 20020108400 - Watanabe, Takeo ; et al.	2002-08-15
Method of making a semiconductor device having a stress relieving mechanism Grant 6,423,571 - Ogino , et al. July 23, 2	2002-07-23
Method of making a semiconductor device having a stress relieving mechanism App 20010051393 - Ogino, Masahiko ; et al.	2001-12-13
Heat resistant resin composition and process for producing the same App 20010044485 - Satsu, Yuichi ; et al.	2001-11-22
Photosensitive resin composition, method for forming pattern therefrom, electronic devices produced by using the same, and method for production thereof Grant 6,291,619 - Maekawa , et al. September 18, 2	2001-09-18
Semiconductor device having a stress relieving mechanism Grant 6,028,364 - Ogino , et al. February 22, 2	2000-02-22
Multi-layer wiring structure Grant 5,768,108 - Miura , et al. June 16, 1	1998-06-16
Photosensitive resin composition containing a carboxylic acid polymer, photoacid generator and secondary or tertiary aliphatic amine Grant 5,633,112 - Miwa , et al. May 27, 1	1997-05-27
LSI package board Grant 5,565,706 - Miura , et al. October 15, 1	1996-10-15
Glass pressure-vessel for a cathode ray tube Grant 5,238,132 - Shibaoka , et al. August 24, 1	1993-08-24
Process for producing metal-polyimide composite article Grant 5,133,989 - Numata , et al. July 28, 1	1992-07-28
Method for forming polyimide film by chemical vapor deposition Grant 4,759,958 - Numata , et al. July 26, 1	1988-07-26
Laminated panel Grant 4,427,743 - Katsuki , et al. January 24, 1	1984-01-24
Low profile unsaturated polyester resin composition Grant 4,102,944 - Fukuyama , et al. July 25, 1	1978-07-25

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