MIURA; Yu
Patent Applications and Registrations
Patent applications and USPTO patent grants for MIURA; Yu.The latest application filed is for "crimp terminal-equipped flexible printed circuit board and method for manufacturing same".
- MIURA; Yu - Tokyo JP
- Miura; Yu - Ichihara JP
- MIURA; Yu - Ichihara-shi JP
- Miura; Yu - Chiba JP
| Patent | Date |
|---|---|
| Crimp Terminal-equipped Flexible Printed Circuit Board And Method For Manufacturing Same App 20220294135 - HIRATA; Masanori ; et al. | 2022-09-15 |
| Flexible Printed Wiring Board With Crimp Terminal App 20210313719 - YAMADA; Shuzo ; et al. | 2021-10-07 |
| Capacitor and method for manufacturing same Grant 11,011,316 - Inoue , et al. May 18, 2 | 2021-05-18 |
| Capacitor And Method For Manufacturing Same App 20210142950 - Inoue; Ryuuta ; et al. | 2021-05-13 |
| Polymer Grant 10,717,792 - Miura , et al. | 2020-07-21 |
| Polymer App 20190309109 - MIURA; Yu ; et al. | 2019-10-10 |
| Polymer Grant 10,370,467 - Miura , et al. | 2019-08-06 |
| Capacitor And Method For Manufacturing Same App 20190198251 - Inoue; Ryuuta ; et al. | 2019-06-27 |
| Heat storage material composition Grant 10,174,236 - Miura , et al. J | 2019-01-08 |
| Polymer App 20180030175 - MIURA; Yu ; et al. | 2018-02-01 |
| Heat Storage Material Composition App 20170088761 - MIURA; Yu ; et al. | 2017-03-30 |
| Thermoplastic Elastomer Composition, Foam Body And Laminated Body App 20110217538 - MIURA; Yu ; et al. | 2011-09-08 |
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