loadpatents
Patent applications and USPTO patent grants for MIURA; Tadamasa.The latest application filed is for "sheet-shaped heat pipe".
Patent | Date |
---|---|
Sheet-shaped Heat Pipe App 20200124352 - WAKAOKA; Takuo ;   et al. | 2020-04-23 |
Sheet-shaped heat pipe Grant 10,544,994 - Wakaoka , et al. Ja | 2020-01-28 |
Temperature detecting device and electronic device Grant 10,502,638 - Miura , et al. Dec | 2019-12-10 |
Electronic apparatus Grant 10,420,252 - Miura , et al. Sept | 2019-09-17 |
Electronic Component App 20180122537 - SENTOKU; Satoru ;   et al. | 2018-05-03 |
Sheet-shaped Heat Pipe App 20180010861 - WAKAOKA; Takuo ;   et al. | 2018-01-11 |
Electronic component Grant 9,831,018 - Ikeda , et al. November 28, 2 | 2017-11-28 |
Thermistor device Grant 9,797,781 - Miura , et al. October 24, 2 | 2017-10-24 |
Temperature Detecting Device And Electronic Device App 20170131156 - MIURA; Tadamasa ;   et al. | 2017-05-11 |
Electronic Apparatus App 20160270252 - MIURA; Tadamasa ;   et al. | 2016-09-15 |
NTC thermistor element and method and method for producing the same Grant 9,373,431 - Ikeda , et al. June 21, 2 | 2016-06-21 |
Thermistor Element App 20160155546 - MIURA; Tadamasa ;   et al. | 2016-06-02 |
Electronic Component App 20160064124 - IKEDA; Hiroshi ;   et al. | 2016-03-03 |
Electronic-component mounting structure Grant 9,184,362 - Miura November 10, 2 | 2015-11-10 |
Electronic component package structure Grant 9,153,762 - Miura October 6, 2 | 2015-10-06 |
Thermistor Device App 20150211940 - MIURA; Tadamasa ;   et al. | 2015-07-30 |
Electronic Apparatus App 20150144295 - MIURA; Tadamasa ;   et al. | 2015-05-28 |
Ntc Thermistor Element And Method And Method For Producing The Same App 20150070127 - Ikeda; Hiroshi ;   et al. | 2015-03-12 |
Thermistor And Method For Manufacturing The Same App 20140232514 - Miura; Tadamasa ;   et al. | 2014-08-21 |
Gas sensor Grant 8,776,578 - Miura July 15, 2 | 2014-07-15 |
Semiconductor ceramic composition for NTC thermistors Grant 8,669,841 - Miura , et al. March 11, 2 | 2014-03-11 |
Semiconductor ceramic element and method for producing same Grant 8,624,703 - Miura January 7, 2 | 2014-01-07 |
Electronic Component Package Structure App 20130328154 - MIURA; Tadamasa | 2013-12-12 |
Electronic-component Mounting Structure App 20130328153 - MIURA; Tadamasa | 2013-12-12 |
Thermistor and method for manufacturing the same Grant 8,598,975 - Miura December 3, 2 | 2013-12-03 |
Moisture-sensitive Ceramic Material And A Moisture-sensitive Ceramic Element App 20130298650 - Miura; Tadamasa | 2013-11-14 |
Semiconductor Ceramic Composition For Ntc Thermistors App 20130229256 - MIURA; Tadamasa ;   et al. | 2013-09-05 |
Thermistor And Method For Manufacturing The Same App 20130221584 - Miura; Tadamasa | 2013-08-29 |
Thermistor and method for manufacturing the same Grant 8,514,050 - Miura August 20, 2 | 2013-08-20 |
Semiconductor Ceramic Element And Method For Producing Same App 20130200989 - MIURA; Tadamasa | 2013-08-08 |
Thermistor and Method for Manufacturing the Same App 20120188051 - Miura; Tadamasa | 2012-07-26 |
Thermal sensor, non-contact thermometer device, and non-contact temperature measurement method Grant 8,192,076 - Nawai , et al. June 5, 2 | 2012-06-05 |
Semi-conductive ceramic material and NTC thermistor using the same Grant 8,035,474 - Miura October 11, 2 | 2011-10-11 |
Gas Sensor App 20110209527 - Miura; Tadamasa | 2011-09-01 |
Thermal Sensor, Non-Contact Thermometer Device, and Non-Contact Temperature Measurement Method App 20110164655 - Nawai; Shinichiro ;   et al. | 2011-07-07 |
Surface-mount negative-characteristic thermistor Grant 7,948,354 - Miura , et al. May 24, 2 | 2011-05-24 |
Semi-conductive Ceramic Material And Ntc Thermistor Using The Same App 20100134237 - MIURA; Tadamasa | 2010-06-03 |
Surface-mount Negative-characteristic Thermistor App 20090167482 - Miura; Tadamasa ;   et al. | 2009-07-02 |
Surface-mount negative-characteristic thermistor Grant 7,548,149 - Miura , et al. June 16, 2 | 2009-06-16 |
Surface-mount Negative-characteristic Thermistor App 20080048821 - MIURA; Tadamasa ;   et al. | 2008-02-28 |
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