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name:-0.032817125320435
name:-0.73869395256042
name:-0.020915031433105
Miura; Shoji Patent Filings

Miura; Shoji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miura; Shoji.The latest application filed is for "water faucet device and method of manufacturing water faucet equipment containing same".

Company Profile
0.32.20
  • Miura; Shoji - Kitakyushu JP
  • MIURA; Shoji - Kitakyushu-shi JP
  • Miura; Shoji - Fukuoka JP
  • Miura; Shoji - Nukata-gun JP
  • Miura; Shoji - Aichi-ken JP
  • Miura; Shoji - Nutaka-gun JP
  • Miura; Shoji - Anjo JP
  • Miura; Shoji - Nukata JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Water faucet device and method of manufacturing water faucet equipment containing same
Grant 8,235,353 - Miyagi , et al. August 7, 2
2012-08-07
Water Faucet Device And Method Of Manufacturing Water Faucet Equipment Containing Same
App 20110005608 - MIYAGI; Takafumi ;   et al.
2011-01-13
Water discharge device
Grant 7,793,365 - Miura , et al. September 14, 2
2010-09-14
Water discharging apparatus
Grant 7,748,649 - Fujii , et al. July 6, 2
2010-07-06
Semiconductor device having tin-based solder layer and method for manufacturing the same
Grant 7,579,212 - Kayukawa , et al. August 25, 2
2009-08-25
Showerhead
Grant 7,537,175 - Miura , et al. May 26, 2
2009-05-26
Method for manufacturing mold type semiconductor device
Grant 7,468,318 - Hirano , et al. December 23, 2
2008-12-23
Semiconductor device having tin-based solder layer and method for manufacturing the same
Grant 7,361,996 - Kayukawa , et al. April 22, 2
2008-04-22
Water Discharge Device
App 20070232108 - Miura; Shoji ;   et al.
2007-10-04
Semiconductor device having tin-based solder layer and method for manufacturing the same
App 20070176293 - Kayukawa; Kimiharu ;   et al.
2007-08-02
Molded semiconductor device with heat conducting members
Grant 7,247,929 - Miura , et al. July 24, 2
2007-07-24
Method for manufacturing mold type semiconductor device
App 20070158850 - Hirano; Naohiko ;   et al.
2007-07-12
Mold type semiconductor device
Grant 7,193,326 - Hirano , et al. March 20, 2
2007-03-20
Power MOS transistor having capability for setting substrate potential independently of source potential
Grant 7,109,558 - Nakano , et al. September 19, 2
2006-09-19
Showerhead
App 20060151640 - Miura; Shoji ;   et al.
2006-07-13
Semiconductor device having aluminum electrode and metallic electrode
App 20060081996 - Shinyama; Keiji ;   et al.
2006-04-20
Semiconductor device having aluminum and metal electrodes and method for manufacturing the same
Grant 7,030,496 - Shinyama , et al. April 18, 2
2006-04-18
Semiconductor equipment having a pair of heat radiation plates
App 20060055056 - Miura; Shoji ;   et al.
2006-03-16
Semiconductor device having tin-based solder layer and method for manufacturing the same
App 20060049521 - Kayukawa; Kimiharu ;   et al.
2006-03-09
Package type semiconductor device
Grant 7,009,292 - Miura , et al. March 7, 2
2006-03-07
Metal oxide semiconductor transistor having a nitrogen cluster containing layer embedded in the substrate
Grant 6,972,459 - Miura , et al. December 6, 2
2005-12-06
Semiconductor device
Grant 6,946,711 - Suzuki , et al. September 20, 2
2005-09-20
Method for manufacturing semiconductor device having controlled surface roughness
Grant 6,927,167 - Fukuda , et al. August 9, 2
2005-08-09
Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip
App 20050170555 - Hirano, Naohiko ;   et al.
2005-08-04
Molded semiconductor power device having heat sinks exposed on one surface
Grant 6,917,103 - Hirano , et al. July 12, 2
2005-07-12
Water discharge
App 20050103895 - Fujii, Makoto ;   et al.
2005-05-19
Package type semiconductor device
App 20050077599 - Miura, Shoji ;   et al.
2005-04-14
Semiconductor device having aluminum and metal electrodes and method for manufacturing the same
App 20050006778 - Shinyama, Keiji ;   et al.
2005-01-13
Mold type semiconductor device and method for manufacturing the same
App 20040256730 - Hirano, Naohiko ;   et al.
2004-12-23
Load drive circuit using flywheel diode
Grant 6,829,152 - Miura , et al. December 7, 2
2004-12-07
Semiconductor device and method for manufacturing the same
Grant 6,809,348 - Suzuki , et al. October 26, 2
2004-10-26
Semiconductor device
App 20040195649 - Miura, Shoji ;   et al.
2004-10-07
Semiconductor device having controlled surface roughness and method for manufacturing the same
App 20040119088 - Fukuda, Yutaka ;   et al.
2004-06-24
Semiconductor power device
App 20030122232 - Hirano, Naohiko ;   et al.
2003-07-03
Load drive circuit using flywheel diode
App 20030107905 - Miura, Shoji ;   et al.
2003-06-12
Semiconductor device and method of manufacturing the same
App 20030003692 - Suzuki, Mikimasa ;   et al.
2003-01-02
Metal oxide semiconductor transistor and manufacturing method for the same
App 20020195651 - Miura, Shoji ;   et al.
2002-12-26
Power MOS transistor having capability for setting substrate potential independently of source potential
App 20020185681 - Nakano, Takashi ;   et al.
2002-12-12
Method for etching trench in manufacturing semiconductor devices
Grant 6,291,315 - Nakayama , et al. September 18, 2
2001-09-18
Semiconductor device having thin film resistor and method of producing same
Grant 6,287,933 - Iida , et al. September 11, 2
2001-09-11
Semiconductor device having multilayer interconnection structure and method for manufacturing the same
Grant 6,274,452 - Miura , et al. August 14, 2
2001-08-14
Semiconductor device having oblique portion as reflection
Grant 6,242,792 - Miura , et al. June 5, 2
2001-06-05
Design for a semiconductor device having elements isolated by insulating regions
Grant 6,104,078 - Iida , et al. August 15, 2
2000-08-15
High withstand voltage type semiconductor device having an isolation region
Grant 5,644,157 - Iida , et al. July 1, 1
1997-07-01
SOI semiconductor device and method of producing same wherein warpage is reduced in the semiconductor device
Grant 5,599,722 - Sugisaka , et al. February 4, 1
1997-02-04
Dielectric isolated type semiconductor device provided with bipolar element
Grant 5,592,015 - Iida , et al. January 7, 1
1997-01-07
Dielectric isolated type semiconductor device
Grant 5,557,134 - Sugisaka , et al. September 17, 1
1996-09-17
Semiconductor device with thin film resistor having reduced film thickness sensitivity during trimming process
Grant 5,525,831 - Ohkawa , et al. June 11, 1
1996-06-11
Dry etching process for semiconductor
Grant 5,522,966 - Komura , et al. June 4, 1
1996-06-04
Method for fabrication of semiconductor device
Grant 5,480,832 - Miura , et al. January 2, 1
1996-01-02
Semiconductor device provided with isolation region
Grant 5,449,946 - Sakakibara , et al. September 12, 1
1995-09-12
Dry etching process for semiconductor
Grant 5,423,941 - Komura , et al. June 13, 1
1995-06-13

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