Miura; Shigeki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miura; Shigeki.The latest application filed is for "plant cultivation system and a method for plant cultivation".

Company Profile

2.9.15

Miura; Shigeki - Tokorozawa JP
MIURA; Shigeki - Tokorozawa-shi JP
Miura; Shigeki - Ikoma-shi JP
Miura; Shigeki - Osaka-shi JP
Miura; Shigeki - Osaka JP
Miura; Shigeki - Nishi-kasugai-gun JP
Miura; Shigeki - Hachioji JP
Miura; Shigeki - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plant cultivation system and a method for plant cultivation Grant 11,058,075 - Yoshioka , et al. July 13, 2	2021-07-13
Plant Cultivation System And A Method For Plant Cultivation App 20200260671 - YOSHIOKA; Hiroshi ; et al.	2020-08-20
Plant cultivation system and a method for plant cultivation Grant 10,660,280 - Yoshioka , et al.	2020-05-26
Plant Cultivation System And A Method For Plant Cultivation App 20160205880 - Yoshioka; Hiroshi ; et al.	2016-07-21
Waterproof Structure For Electronic Device App 20130200768 - Miura; Shigeki ; et al.	2013-08-08
Electrode substrate having conductive layers with different properties made of conductive materials with different properties formed on transparent base material App 20090188700 - Miura; Shigeki	2009-07-30
Method of forming Sn-Ag-Cu ternary alloy thin-film on base material Grant 7,563,353 - Miura July 21, 2	2009-07-21
Method of Forming Sn-Ag-Cu Ternary Alloy Thin-Film on Base Material App 20070297937 - Miura; Shigeki	2007-12-27
Conductive sheet having conductive layer with improved adhesion and product including the same App 20060254052 - Miura; Shigeki	2006-11-16
Stabilized aluminum laminate having aluminum and stabilizing layer laminated thereon App 20060240272 - Miura; Shigeki	2006-10-26
Terminal having surface layer formed of Sn-Ag-Cu ternary alloy formed thereon, and part and product having the same App 20050123784 - Miura, Shigeki	2005-06-09
Conductive sheet having metal layer formed on at least a portion of surface of insulating substrate, product using the same, and manufacturing method thereof App 20050073047 - Miura, Shigeki	2005-04-07
Conductive sheet having conductive layer with improved adhesion and product including the same App 20050029014 - Miura, Shigeki	2005-02-10
Terminal with ruthenium layer and part having the same App 20040038072 - Miura, Shigeki	2004-02-26
Scroll compressor Grant 6,695,598 - Fujita , et al. February 24, 2	2004-02-24
Material For Electronic Components, Method Of Connecting Material For Electronic Components, Ball Grid Array Type Electronic Components And Method Of Connecting Ball Grid Array Type Electronic Components Grant 6,603,205 - Miura August 5, 2	2003-08-05
Scroll compressor App 20020094292 - Fujita, Katsuhiro ; et al.	2002-07-18
Material for electronic components, method of connecting material for electronic components, ball grid array type electronic components and method of connecting ball grid array type electronic components App 20020071961 - Miura, Shigeki	2002-06-13
Compressor having a seal member for supporting a shaft during assembly App 20020057977 - Fujita, Katsuhiro ; et al.	2002-05-16
Scroll hydraulic machine Grant 6,146,117 - Miura , et al. November 14, 2	2000-11-14
Scroll hydraulic machine Grant 6,123,527 - Kawada , et al. September 26, 2	2000-09-26
Image data processing using bi-level and multi-level value data Grant 5,521,990 - Ishizawa , et al. May 28, 1	1996-05-28
Capacity control mechanism for scroll-type compressor Grant 5,356,271 - Miura , et al. October 18, 1	1994-10-18

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