MIURA; Kazuma
Patent Applications and Registrations
Patent applications and USPTO patent grants for MIURA; Kazuma.The latest application filed is for "drying device and drying method".
- MIURA; Kazuma - Nagoya-shi JP
- Miura; Kazuma - Yokohama JP
- Miura; Kazuma - Niigata-ken JP
- Miura; Kazuma - Sanjo JP
- Miura; Kazuma - Tokyo JP
- Miura; Kazuma - Sanjo-shi JP
| Patent | Date |
|---|---|
| Drying Device And Drying Method App 20220282917 - MIURA; Kazuma ; et al. | 2022-09-08 |
| Solder composition for electronic devices Grant 8,022,551 - Soga , et al. September 20, 2 | 2011-09-20 |
| Method for manufacturing a stainless steel product and a stainless steel product manufactured by the method Grant 7,875,128 - Kuroda , et al. January 25, 2 | 2011-01-25 |
| Solder foil, semiconductor device and electronic device Grant 7,722,962 - Soga , et al. May 25, 2 | 2010-05-25 |
| Semiconductor device with lead-free solder Grant 7,259,465 - Soga , et al. August 21, 2 | 2007-08-21 |
| Method For Manufacturing A Stainless Steel Product And A Stainless Steel Product Manufactured By The Method App 20070186999 - Kuroda; Daisuke ; et al. | 2007-08-16 |
| Solder composition for electronic devices App 20070031279 - Soga; Tasao ; et al. | 2007-02-08 |
| Semiconductor device having solder bumps reliably reflow solderable Grant 7,145,236 - Miura , et al. December 5, 2 | 2006-12-05 |
| Solder foil semiconductor device and electronic device App 20060061974 - Soga; Tasao ; et al. | 2006-03-23 |
| Electronic apparatus App 20040177997 - Hata, Hanae ; et al. | 2004-09-16 |
| Product using Zn-Al alloy solder Grant 6,563,225 - Soga , et al. May 13, 2 | 2003-05-13 |
| Semiconductor device having solder bumps reliably reflow solderable App 20030030149 - Miura, Kazuma ; et al. | 2003-02-13 |
| Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate Grant 6,486,411 - Miura , et al. November 26, 2 | 2002-11-26 |
| Electronic device App 20020171157 - Soga, Tasao ; et al. | 2002-11-21 |
| Product using Zn-Al alloy solder App 20020149114 - Soga, Tasao ; et al. | 2002-10-17 |
| Electronic device App 20020114726 - Soga, Tasao ; et al. | 2002-08-22 |
| Electronic device App 20020100986 - Soga, Tasao ; et al. | 2002-08-01 |
| Semiconductor module and circuit substrate App 20010050181 - Miura, Kazuma ; et al. | 2001-12-13 |
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