loadpatents
name:-0.019872188568115
name:-0.0073831081390381
name:-0.01419997215271
Mitsuishi; Hajime Patent Filings

Mitsuishi; Hajime

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mitsuishi; Hajime.The latest application filed is for "apparatus for stacking substrates and method for the same".

Company Profile
11.6.18
  • Mitsuishi; Hajime - Tokyo JP
  • MITSUISHI; Hajime - Yokohama-shi JP
  • Mitsuishi; Hajime - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Manufacturing method and manufacturing apparatus for stacked substrate, and program
Grant 11,362,059 - Sugaya , et al. June 14, 2
2022-06-14
Apparatus For Stacking Substrates And Method For The Same
App 20220148978 - SUGAYA; Isao ;   et al.
2022-05-12
Substrate Bonding Apparatus And Substrate Bonding Method
App 20220084870 - MITSUISHI; Hajime ;   et al.
2022-03-17
Apparatus for stacking substrates and method for the same
Grant 11,211,338 - Sugaya , et al. December 28, 2
2021-12-28
Substrate Bonding Device, Calculation Device, Substrate Bonding Method, And Calculation Method
App 20210242044 - MITSUISHI; Hajime ;   et al.
2021-08-05
Bonding Method, Bonding Device, And Holding Member
App 20210225651 - MITSUISHI; Hajime ;   et al.
2021-07-22
Bonding Method And Bonding Device
App 20210138778 - MAEHARA; Yoshihiro ;   et al.
2021-05-13
Bonding method, bonding device, and holding member
Grant 11,004,686 - Mitsuishi , et al. May 11, 2
2021-05-11
Alignment Method And Alignment Apparatus
App 20200381387 - MITSUISHI; Hajime ;   et al.
2020-12-03
Stacking apparatus and stacking method
Grant 10,825,707 - Mitsuishi , et al. November 3, 2
2020-11-03
Substrate Bonding Apparatus and Substrate Bonding Method
App 20200335472 - OKAMOTO; Kazuya ;   et al.
2020-10-22
Method And Device For Manufacturing Stacked Substrate
App 20200286851 - Mitsuishi; Hajime ;   et al.
2020-09-10
Manufacturing Method And Manufacturing Apparatus For Stacked Substrate, And Program
App 20200273836 - SUGAYA; Isao ;   et al.
2020-08-27
Substrate Bonding Method, Multilayer Substrate Manufacturing Method, Multilayer Substrate Manufacturing Apparatus, And Multilaye
App 20200091015 - SUGAYA; Isao ;   et al.
2020-03-19
Apparatus For Stacking Substrates And Method For The Same
App 20200043860 - SUGAYA; Isao ;   et al.
2020-02-06
Apparatus for stacking substrates and method for the same
Grant 10,483,212 - Sugaya , et al. Nov
2019-11-19
Substrate bonding apparatus and substrate bonding method
Grant 10,424,557 - Sugaya , et al. Sept
2019-09-24
Bonding Method, Bonding Device, And Holding Member
App 20190267238 - MITSUISHI; Hajime ;   et al.
2019-08-29
Stacked Substrate Manufacturing Method, Stacked Substrate Manufacturing Apparatus, Stacked Substrate Manufacturing System, And S
App 20190148184 - SUGAYA; Isao ;   et al.
2019-05-16
Stacking Apparatus And Stacking Method
App 20190122915 - MITSUISHI; Hajime ;   et al.
2019-04-25
Substrate Bonding Apparatus And Substrate Bonding Method
App 20190043826 - SUGAYA; Isao ;   et al.
2019-02-07
Substrate Bonding Apparatus And Substrate Bonding Method
App 20180308770 - SUGAYA; Isao ;   et al.
2018-10-25
Apparatus For Stacking Substrates And Method For The Same
App 20170278803 - Sugaya; Isao ;   et al.
2017-09-28
Substrate Bonding Apparatus and Substrate Bonding Method
App 20150083786 - OKAMOTO; Kazuya ;   et al.
2015-03-26

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