Mitsugi; Shingo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mitsugi; Shingo.The latest application filed is for "cellulose-fiber dispersion polyethylene resin composite material, formed body and pellet using same, production method therefor, and recycling method for cellulose-fiber adhesion polyethylene thin film piece".

Company Profile

0.4.5

Mitsugi; Shingo - Tokyo JP
Mitsugi; Shingo - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cellulose-aluminum-dispersing polyethylene resin composite material, pellet and formed body using same, and production method therefor Grant 11,390,723 - Hara , et al. July 19, 2	2022-07-19
Cellulose-fiber dispersion polyethylene resin composite material, formed body and pellet using same, production method therefor, and recycling method for cellulose-fiber adhesion polyethylene thin film piece Grant 11,390,724 - Hiroishi , et al. July 19, 2	2022-07-19
Cellulose-fiber Dispersion Polyethylene Resin Composite Material, Formed Body And Pellet Using Same, Production Method Therefor, And Recycling Method For Cellulose-fiber Adhesion Polyethylene Thin Film Piece App 20210139664 - HIROISHI; Jirou ; et al.	2021-05-13
Cellulose-fiber Dispersion Polyethylene Resin Composite Material, Formed Body And Pellet Using Same, Production Method Therefor, App 20200172684 - HIROISHI; Jirou ; et al.	2020-06-04
Cellulose-aluminum-dispersing Polyethylene Resin Composite Material, Pellet And Formed Body Using Same, And Production Method Th App 20200079920 - SAWADA; Yuka ; et al.	2020-03-12
Cellulose-aluminum-dispersing Polyethylene Resin Composite Material, Pellet And Formed Body Using Same, And Production Method Th App 20200062921 - HARA; Hidekazu ; et al.	2020-02-27
Semiconductor device and manufacturing method thereof Grant 8,786,110 - Marutani , et al. July 22, 2	2014-07-22
Semiconductor Device And Manufacturing Method Thereof App 20120074594 - MARUTANI; Hisakazu ; et al.	2012-03-29

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