Mitchell; Craig S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Mitchell; Craig S..The latest application filed is for "stacked packaging improvements".
Company Profile
0.33.29
- Mitchell; Craig S. - San Jose CA
- Mitchell; Craig S. - Santa Clara CA
Patent Activity
| Patent | Date |
|---|---|
| Stacked packaging improvements Grant 9,570,416 - Haba , et al. February 14, 2 | 2017-02-14 |
| Stacked Packaging Improvements App 20160035692 - Haba; Belgacem ; et al. | 2016-02-04 |
| Stacked packaging improvements Grant 9,153,562 - Haba , et al. October 6, 2 | 2015-10-06 |
| Stacked Packaging Improvements App 20150102508 - Haba; Belgacem ; et al. | 2015-04-16 |
| Stacked packaging improvements Grant 8,927,337 - Haba , et al. January 6, 2 | 2015-01-06 |
| Substrate for a microelectronic package and method of fabricating thereof Grant 8,686,551 - Haba , et al. April 1, 2 | 2014-04-01 |
| Stacked Packaging Improvements App 20130344682 - Haba; Belgacem ; et al. | 2013-12-26 |
| Stacked packaging improvements Grant 8,531,020 - Haba , et al. September 10, 2 | 2013-09-10 |
| Stacked packaging improvements Grant 8,525,314 - Haba , et al. September 3, 2 | 2013-09-03 |
| Substrate For A Microelectronic Package And Method Of Fabricating Thereof App 20120241960 - Haba; Belgacem ; et al. | 2012-09-27 |
| Substrate For A Microelectronic Package And Method Of Fabricating Thereof App 20120056324 - Haba; Belgacem ; et al. | 2012-03-08 |
| Substrate for a microelectronic package and method of fabricating thereof Grant 8,071,424 - Haba , et al. December 6, 2 | 2011-12-06 |
| Microelectronic assemblies having very fine pitch stacking Grant 8,067,267 - Haba , et al. November 29, 2 | 2011-11-29 |
| Stacked Packaging Improvements App 20110042810 - Haba; Belgacem ; et al. | 2011-02-24 |
| Substrate For A Microelectronic Package And Method Of Fabricating Thereof App 20100273293 - Haba; Belgacem ; et al. | 2010-10-28 |
| Substrate for a microelectronic package and method of fabricating thereof Grant 7,759,782 - Haba , et al. July 20, 2 | 2010-07-20 |
| Microelectronic elements with compliant terminal mountings and methods for making the same Grant 7,534,652 - Haba , et al. May 19, 2 | 2009-05-19 |
| Stacked Packaging Improvements App 20090104736 - Haba; Belgacem ; et al. | 2009-04-23 |
| Multilayer substrate with interconnection vias and method of manufacturing the same App 20090071707 - Endo; Kimitaka ; et al. | 2009-03-19 |
| Image sensor package and fabrication method Grant 7,368,695 - Kang , et al. May 6, 2 | 2008-05-06 |
| Methods of making microelectronic assemblies including compliant interfaces Grant 7,368,818 - Kovac , et al. May 6, 2 | 2008-05-06 |
| Microelectronic assembly having array including passive elements and interconnects Grant 7,335,995 - Pflughaupt , et al. February 26, 2 | 2008-02-26 |
| Micro lead frame packages and methods of manufacturing the same Grant 7,309,910 - Mitchell , et al. December 18, 2 | 2007-12-18 |
| Substrate for a microelectronic package and method of fabricating thereof App 20070235856 - Haba; Belgacem ; et al. | 2007-10-11 |
| Microelectronic assemblies having very fine pitch stacking App 20070148819 - Haba; Belgacem ; et al. | 2007-06-28 |
| Microelectronic elements with compliant terminal mountings and methods for making the same App 20070145550 - Haba; Belgacem ; et al. | 2007-06-28 |
| Back-face and edge interconnects for lidded package Grant 7,224,056 - Burtzlaff , et al. May 29, 2 | 2007-05-29 |
| Micro lead frame packages and methods of manufacturing the same App 20070105282 - Mitchell; Craig S. ; et al. | 2007-05-10 |
| Back-face and edge interconnects for lidded package App 20070096295 - Burtzlaff; Robert ; et al. | 2007-05-03 |
| Structure and method of making capped chips having vertical interconnects App 20070096311 - Humpston; Giles ; et al. | 2007-05-03 |
| Micro lead frame packages and methods of manufacturing the same Grant 7,202,112 - Mitchell , et al. April 10, 2 | 2007-04-10 |
| Micro lead frame packages and methods of manufacturing the same App 20060099789 - Mitchell; Craig S. ; et al. | 2006-05-11 |
| Stacked packages App 20060033216 - Pflughaupt; L. Elliott ; et al. | 2006-02-16 |
| Image sensor package and fabrication method App 20050279916 - Kang, Teck-Gyu ; et al. | 2005-12-22 |
| Stacked packages Grant 6,977,440 - Pflughaupt , et al. December 20, 2 | 2005-12-20 |
| Microelectronic assembly having array including passive elements and interconnects App 20050173796 - Pflughaupt, L. Elliott ; et al. | 2005-08-11 |
| Stacked packages Grant 6,913,949 - Pflughaupt , et al. July 5, 2 | 2005-07-05 |
| Stacked packages Grant 6,897,565 - Pflughaupt , et al. May 24, 2 | 2005-05-24 |
| Structure and method of making capped chips having vertical interconnects App 20050095835 - Humpston, Giles ; et al. | 2005-05-05 |
| Back-face and edge interconnects for lidded package App 20050087861 - Burtzlaff, Robert ; et al. | 2005-04-28 |
| Stacked microelectronic assemblies and methods of making same Grant 6,885,106 - Damberg , et al. April 26, 2 | 2005-04-26 |
| Stacked packages App 20040203190 - Pflughaupt, L. Elliott ; et al. | 2004-10-14 |
| Stacked packages App 20040031972 - Pflughaupt, L. Elliott ; et al. | 2004-02-19 |
| Compliant integrated circuit package App 20030207499 - DiStefano, Thomas H. ; et al. | 2003-11-06 |
| Encapsulation of microelectronic assemblies Grant 6,602,740 - Mitchell August 5, 2 | 2003-08-05 |
| Stacked packages App 20030107118 - Pflughaupt, L. Elliott ; et al. | 2003-06-12 |
| Encapsulation of microelectronic assemblies Grant 6,541,874 - Nguyen , et al. April 1, 2 | 2003-04-01 |
| Low-height multi-component assemblies App 20030048624 - Damberg, Philip ; et al. | 2003-03-13 |
| Methods of making microelectronic assemblies including compliant interfaces App 20030027374 - Kovac, Zlata ; et al. | 2003-02-06 |
| Methods of encapsulating a semiconductor chip using a settable encapsulant Grant 6,458,628 - Distefano , et al. October 1, 2 | 2002-10-01 |
| Methods of making microelectronic assemblies including compliant interfaces App 20020109213 - Kovac, Zlata ; et al. | 2002-08-15 |
| Encapsulation of microelectronic assemblies Grant 6,329,224 - Nguyen , et al. December 11, 2 | 2001-12-11 |
| Encapsulation of microelectronic assemblies App 20010023995 - Nguyen, Tan ; et al. | 2001-09-27 |
| Methods of encapsulating a semiconductor chip using a settable encapsulant Grant 6,218,215 - Distefano , et al. April 17, 2 | 2001-04-17 |
| Lamination machine and method to laminate a coverlay to a microelectronic package Grant 6,197,665 - DiStefano , et al. March 6, 2 | 2001-03-06 |
| Vacuum dispense apparatus for dispensing an encapsulant Grant 6,126,428 - Mitchell , et al. October 3, 2 | 2000-10-03 |
| Methods of encapsulating a semiconductor chip using a settable encapsulant Grant 6,080,605 - Distefano , et al. June 27, 2 | 2000-06-27 |
| Vacuum dispense method for dispensing an encapsulant and machine therefor Grant 6,046,076 - Mitchell , et al. April 4, 2 | 2000-04-04 |
| Method of encapsulating a semiconductor package Grant 5,776,796 - Distefano , et al. July 7, 1 | 1998-07-07 |
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