Mita; Yasuhiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mita; Yasuhiro.The latest application filed is for "soaked de-swage method for rebuilding head stack assembly".

Company Profile

0.11.10

Mita; Yasuhiro - Kanagawa JP
Mita; Yasuhiro - Kanagawa-ken JP
Mita; Yasuhiro - Fujisawa JP
Mita, Yasuhiro - Fujisawa-shi JP
Mita; Yasuhiro - Kokubunji JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Soaked de-swage method for rebuilding head stack assembly Grant 7,480,982 - Hosaka , et al. January 27, 2	2009-01-27
Method of constructing an integrated lead suspension Grant 7,168,154 - Tsuchiya , et al. January 30, 2	2007-01-30
Method of constructing an integrated lead suspension Grant 7,137,189 - Tsuchiya , et al. November 21, 2	2006-11-21
Method of constructing an integrated lead suspension Grant 7,137,188 - Tsuchiya , et al. November 21, 2	2006-11-21
Soaked de-swage method for rebuilding head stack assembly App 20060085970 - Hosaka; Junichi ; et al.	2006-04-27
Integrated lead suspension and method of construction Grant 6,989,969 - Tsuchiya , et al. January 24, 2	2006-01-24
Integrated lead suspension and method of construction Grant 6,985,335 - Tsuchiya , et al. January 10, 2	2006-01-10
Integrated lead suspension and method of construction App 20050078415 - Tsuchiya, Tatsumi ; et al.	2005-04-14
Integrated lead suspension and method of construction Grant 6,879,465 - Tsuchiya , et al. April 12, 2	2005-04-12
Method of constructing an integrated lead suspension Grant 6,871,392 - Tsuchiya , et al. March 29, 2	2005-03-29
Integrated lead suspension and method of construction App 20050063096 - Tsuchiya, Tatsumi ; et al.	2005-03-24
Integrated lead suspension and method of construction App 20050047009 - Tsuchiya, Tatsumi ; et al.	2005-03-03
Integrated lead suspension and method of construction App 20050047022 - Tsuchiya, Tatsumi ; et al.	2005-03-03
Integrated lead suspension and method of construction App 20050047020 - Tsuchiya, Tatsumi ; et al.	2005-03-03
Apparatus and method for separating head gimbal assembly from bonding jig Grant 6,848,167 - Mita , et al. February 1, 2	2005-02-01
Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus Grant 6,742,694 - Satoh , et al. June 1, 2	2004-06-01
Integrated lead suspension and method of construction App 20030188887 - Tsuchiya, Tatsumi ; et al.	2003-10-09
Integrated lead suspension and method of construction App 20030070834 - Tsuchiya, Tatsumi ; et al.	2003-04-17
Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus App 20020113115 - Satoh, Takuya ; et al.	2002-08-22
Apparatus and method for separating head gimbal assembly from bonding jig App 20010054225 - Mita, Yasuhiro ; et al.	2001-12-27
Multicellular transmission method and apparatus Grant 5,940,385 - Mita , et al. August 17, 1	1999-08-17

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