Mita; Ryota

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mita; Ryota.The latest application filed is for "vehicle position detection device and parameter set creation device for vehicle position detection".

Company Profile

6.3.20

Mita; Ryota - Ibaraki JP
MITA; Ryota - Tokyo JP
Mita; Ryota - Ibaraki-shi JP
MITA; Ryota - Osaka JP
Mita; Ryota - Hitachinaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method for semiconductor device Grant 11,456,215 - Mita , et al. September 27, 2	2022-09-27
Vehicle Position Detection Device And Parameter Set Creation Device For Vehicle Position Detection App 20220236063 - MITA; Ryota	2022-07-28
Semiconductor Device And Method For Producing Semiconductor Device App 20220230989 - Sato; Mayu ; et al.	2022-07-21
Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheet Grant 11,352,527 - Ichikawa , et al. June 7, 2	2022-06-07
Laminate App 20210407952 - Mita; Ryota ; et al.	2021-12-30
Manufacturing Method For Semiconductor Device App 20210242165 - MITA; Ryota ; et al.	2021-08-05
Manufacturing Method For Semiconductor Device App 20210193523 - MITA; Ryota ; et al.	2021-06-24
Sinter-bonding Composition, Sinter-bonding Sheet And Dicing Tape With Sinter-bonding Sheet App 20210174984 - ICHIKAWA; Tomoaki ; et al.	2021-06-10
Thermosetting Sheet And Dicing Die Bonding Film App 20210139745 - Ichikawa; Tomoaki ; et al.	2021-05-13
Thermosetting Sheet And Dicing Die Bonding Film App 20210139746 - Ichikawa; Tomoaki ; et al.	2021-05-13
Manufacturing Method For Semiconductor Device App 20210098418 - MITA; Ryota ; et al.	2021-04-01
Sinter-bonding Composition, Sinter-bonding Sheet And Dicing Tape With Sinter-bonding Sheet App 20200308456 - ICHIKAWA; Tomoaki ; et al.	2020-10-01
Sheet For Sintering Bonding And Sheet For Sintering Bonding With Base Material App 20200294961 - MITA; Ryota ; et al.	2020-09-17
Sheet For Sintering Bonding And Sheet For Sintering Bonding With Base Material App 20200294951 - MITA; Ryota ; et al.	2020-09-17
Sheet For Sintering Bonding, Sheet For Sintering Bonding With Base Material, And Semiconductor Chip With Layer Of Material For Sintering Bonding App 20200294952 - MITA; Ryota ; et al.	2020-09-17
Sheet For Sintering Bonding And Sheet For Sintering Bonding With Base Material App 20200290160 - MITA; Ryota ; et al.	2020-09-17
Wound Body Of Sheet For Sintering Bonding With Base Material App 20200290833 - MITA; Ryota ; et al.	2020-09-17
Encapsulating Sheet, Production Method Thereof, Optical Semiconductor Device And Encapsulated Optical Semiconductor Element App 20170152357 - MATSUDA; Hirokazu ; et al.	2017-06-01
Release Sheet And Release Sheet-including Silicone Resin Sheet App 20160176160 - MITA; Ryota ; et al.	2016-06-23
Encapsulating Sheet App 20140178678 - KATAYAMA; Hiroyuki ; et al.	2014-06-26
Cellular phone Grant 7,197,149 - Mita , et al. March 27, 2	2007-03-27
Communication terminal apparatus and reproducing method App 20050105714 - Ono, Tomoaki ; et al.	2005-05-19
Portable mobile unit App 20020082059 - Nariai, Koichiro ; et al.	2002-06-27

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