MITA; Mamoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for MITA; Mamoru.The latest application filed is for "metal-film forming method, method for manufacturing a metal-film formed product and system for manufacturing the same".

Company Profile

0.19.11

MITA; Mamoru - Hitachi JP
Mita; Mamoru - Hitachi-shi JP
Mita; Mamoru - Tokyo JP
Mita; Mamoru - Ibaraki JP
Mita; Mamoru - Ibaraki-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal-film Forming Method, Method For Manufacturing A Metal-film Formed Product And System For Manufacturing The Same App 20150093516 - ARAGA; Shinji ; et al.	2015-04-02
Method for fabricating an electronic device substrate Grant 8,230,591 - Chinda , et al. July 31, 2	2012-07-31
Electronic device substrate and its fabrication method, and electronic device and its fabrication method Grant 8,101,864 - Chinda , et al. January 24, 2	2012-01-24
Lead frame, method of making the same and light receiving/emitting device Grant 7,888,697 - Kawanobe , et al. February 15, 2	2011-02-15
Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same Grant 7,780,836 - Chinda , et al. August 24, 2	2010-08-24
Electronic Device Substrate And Its Fabrication Method, And Electronic Device And Its Fabrication Method App 20090211796 - Chinda; Akira ; et al.	2009-08-27
Lead Frame, Method Of Making The Same And Light Receiving/emitting Device App 20090141498 - KAWANOBE; Tadashi ; et al.	2009-06-04
Electronic device substrate and its fabrication method, and electronic device and its fabrication method App 20080201943 - Chinda; Akira ; et al.	2008-08-28
Wiring board, method for manufacturing wiring board and electronic component using wiring board Grant 7,268,408 - Chinda , et al. September 11, 2	2007-09-11
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same Grant 7,202,570 - Nagai , et al. April 10, 2	2007-04-10
Electronic device substrate and its fabrication method, and electronic device and its fabrication method App 20060225918 - Chinda; Akira ; et al.	2006-10-12
Wiring tape for semiconductor device including a buffer layer having interconnected foams Grant 7,038,325 - Ogino , et al. May 2, 2	2006-05-02
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same App 20040224149 - Nagai, Akira ; et al.	2004-11-11
Wiring tape for semiconductor device including a buffer layer having interconnected foams App 20040195702 - Ogino, Masahiko ; et al.	2004-10-07
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same Grant 6,791,194 - Nagai , et al. September 14, 2	2004-09-14
Wiring board, method for manufacturing wiring board and electronic component using wiring board App 20030178713 - Chinda, Akira ; et al.	2003-09-25
Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device Grant 6,506,627 - Murakamz , et al. January 14, 2	2003-01-14
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same App 20020160185 - Nagai, Akira ; et al.	2002-10-31
Semiconductor device and wiring tape for semiconductor device App 20020158343 - Ogino, Masahiko ; et al.	2002-10-31
Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy Grant 6,297,142 - Mita , et al. October 2, 2	2001-10-02
Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same App 20010002066 - Mita, Mamoru ; et al.	2001-05-31
Semiconductor device Grant 6,049,128 - Kitano , et al. April 11, 2	2000-04-11
Semiconductor device, interposer for semiconductor device Grant 6,031,292 - Murakami , et al. February 29, 2	2000-02-29
Electrode structure of wiring substrate of semiconductor device having expanded pitch Grant 5,886,409 - Ishino , et al. March 23, 1	1999-03-23
Interposer for semiconductor device Grant 5,866,948 - Murakami , et al. February 2, 1	1999-02-02
Method of manufacturing double-sided circuit tape carrier Grant 5,837,154 - Okabe , et al. November 17, 1	1998-11-17
Method for manufacturing composite lead frame Grant 5,428,889 - Mita , et al. July 4, 1	1995-07-04
High pin count and multi-layer wiring lead frame Grant 5,196,725 - Mita , et al. March 23, 1	1993-03-23

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