Mita; Kunihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mita; Kunihiko.The latest application filed is for "heat dissipating member".

Company Profile

0.11.11

Mita; Kunihiko - Usui-gun JP
Mita; Kunihiko - Gunma-ken JP
Mita; Kunihiko - Annaka JP
Mita; Kunihiko - Gunma JP
Mita, Kunihiko - Annaka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Silicon grease compositions Grant 7,510,998 - Yamada , et al. March 31, 2	2009-03-31
Heat dissipating member Grant 7,484,556 - Mita , et al. February 3, 2	2009-02-03
Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work Grant 7,417,078 - Fujiki , et al. August 26, 2	2008-08-26
Heat conductive composite sheet and process for producing same Grant 7,279,224 - Aoki , et al. October 9, 2	2007-10-09
Heat dissipating member App 20070023179 - Mita; Kunihiko ; et al.	2007-02-01
Curable organopolysiloxane composition and semiconductor device Grant 7,141,273 - Endo , et al. November 28, 2	2006-11-28
Radiating structural body of electronic part and radiating sheet used for the radiating structural body Grant 7,016,196 - Tomaru , et al. March 21, 2	2006-03-21
Silicone grease compositions App 20050261140 - Yamada, Kunihiro ; et al.	2005-11-24
Heat-dissipating member, manufacturing method and installation method Grant 6,940,722 - Tetsuka , et al. September 6, 2	2005-09-06
Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same Grant 6,884,660 - Tetsuka , et al. April 26, 2	2005-04-26
Curable organopolysiloxane composition and semiconductor device App 20050084691 - Endo, Akihiro ; et al.	2005-04-21
Heat radiating member App 20040094293 - Mita, Kunihiko ; et al.	2004-05-20
Radiating structural body of electronic part and radiating sheet used for the radiating structural body App 20040057206 - Tomaru, Kazuhiko ; et al.	2004-03-25
Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work App 20040054029 - Fujiki, Hironao ; et al.	2004-03-18
Heat conductive composite sheet and process for producing same App 20040043229 - Aoki, Yoshitaka ; et al.	2004-03-04
Heat dissipating structure Grant 6,663,964 - Mita , et al. December 16, 2	2003-12-16
Fluorosilicone rubber compositions Grant 6,610,778 - Takita , et al. August 26, 2	2003-08-26
Heat-dissipating member, manufacturing method and installation method App 20030151898 - Tetsuka, Hiroaki ; et al.	2003-08-14
Thermoconducting silicone composition, its curing product and installation method, and a heat dissipating structure of a semiconductor device using same App 20030127496 - Tetsuka, Hiroaki ; et al.	2003-07-10
Heat dissipating structure App 20030096116 - Mita, Kunihiko ; et al.	2003-05-22
Fluorosilicone rubber compositions App 20020061953 - Takita, Kenichi ; et al.	2002-05-23
Electroconductive silicone rubber composition and cured silicone rubber article thereof Grant 5,082,596 - Fukuda , et al. January 21, 1	1992-01-21

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