loadpatents
name:-0.012847900390625
name:-0.015109777450562
name:-0.00044488906860352
Misumi; Kazuyuki Patent Filings

Misumi; Kazuyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Misumi; Kazuyuki.The latest application filed is for "semiconductor device and method of manufacturing same".

Company Profile
0.16.13
  • Misumi; Kazuyuki - Tokyo JP
  • Misumi; Kazuyuki - Hyogo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of manufacturing semiconductor device, and wire bonder
Grant 8,881,966 - Misumi , et al. November 11, 2
2014-11-11
Semiconductor device and method of manufacturing same
Grant 8,652,880 - Bando , et al. February 18, 2
2014-02-18
Method for manufacturing magnetic memory chip device
Grant 8,524,510 - Misumi , et al. September 3, 2
2013-09-03
Semiconductor Device And Method Of Manufacturing Same
App 20120309131 - BANDO; KOJI ;   et al.
2012-12-06
Semiconductor device and method of manufacturing same
Grant 8,258,604 - Bando , et al. September 4, 2
2012-09-04
Method For Manufacturing Magnetic Memory Chip Device
App 20120122246 - MISUMI; Kazuyuki ;   et al.
2012-05-17
Method for manufacturing magnetic memory chip device
Grant 8,124,425 - Misumi , et al. February 28, 2
2012-02-28
Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor
Grant 8,097,942 - Misumi , et al. January 17, 2
2012-01-17
Semiconductor device
Grant 7,915,719 - Misumi , et al. March 29, 2
2011-03-29
Method Of Manufacturing Semiconductor Device, And Wire Bonder
App 20100203681 - MISUMI; KAZUYUKI ;   et al.
2010-08-12
Resin molded semiconductor device and differential amplifier circuit
Grant 7,763,966 - Misumi , et al. July 27, 2
2010-07-27
Semiconductor Device And Method Of Manufacturing Same
App 20100164077 - Bando; Koji ;   et al.
2010-07-01
Method For Manufacturing Magnetic Memory Chip Device
App 20100120176 - Misumi; Kazuyuki ;   et al.
2010-05-13
Semiconductor Device And Manufacturing Method Therefor
App 20100001386 - Misumi; Kazuyuki ;   et al.
2010-01-07
Semiconductor Device
App 20090085179 - Misumi; Kazuyuki ;   et al.
2009-04-02
Semiconductor device
App 20080217750 - Misumi; Kazuyuki ;   et al.
2008-09-11
Semiconductor device
Grant 7,151,316 - Misumi December 19, 2
2006-12-19
Semiconductor device
App 20050006764 - Misumi, Kazuyuki
2005-01-13
Semiconductor device
Grant 6,841,870 - Misumi January 11, 2
2005-01-11
Sealed semiconductor device and lead frame used for the same
Grant 6,737,733 - Misumi , et al. May 18, 2
2004-05-18
Semiconductor device
App 20040016999 - Misumi, Kazuyuki
2004-01-29
Lead frame with raised leads and plastic packaged semiconductor device using the same
Grant 6,614,101 - Misumi , et al. September 2, 2
2003-09-02
Resin-encapsulated semiconductor device
Grant 6,552,418 - Misumi , et al. April 22, 2
2003-04-22
Lead Frame With Raised Leads And Plastic Packaged Semiconductor Device Using The Same
App 20020105060 - Misumi, Kazuyuki ;   et al.
2002-08-08
Sealed semiconductor device and lead frame used for the same
App 20020070431 - Misumi, Kazuyuki ;   et al.
2002-06-13
Resin-encapsulated semiconductor device
App 20020030251 - Misumi, Kazuyuki ;   et al.
2002-03-14

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