loadpatents
Patent applications and USPTO patent grants for Misumi; Kazuyuki.The latest application filed is for "semiconductor device and method of manufacturing same".
Patent | Date |
---|---|
Method of manufacturing semiconductor device, and wire bonder Grant 8,881,966 - Misumi , et al. November 11, 2 | 2014-11-11 |
Semiconductor device and method of manufacturing same Grant 8,652,880 - Bando , et al. February 18, 2 | 2014-02-18 |
Method for manufacturing magnetic memory chip device Grant 8,524,510 - Misumi , et al. September 3, 2 | 2013-09-03 |
Semiconductor Device And Method Of Manufacturing Same App 20120309131 - BANDO; KOJI ;   et al. | 2012-12-06 |
Semiconductor device and method of manufacturing same Grant 8,258,604 - Bando , et al. September 4, 2 | 2012-09-04 |
Method For Manufacturing Magnetic Memory Chip Device App 20120122246 - MISUMI; Kazuyuki ;   et al. | 2012-05-17 |
Method for manufacturing magnetic memory chip device Grant 8,124,425 - Misumi , et al. February 28, 2 | 2012-02-28 |
Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor Grant 8,097,942 - Misumi , et al. January 17, 2 | 2012-01-17 |
Semiconductor device Grant 7,915,719 - Misumi , et al. March 29, 2 | 2011-03-29 |
Method Of Manufacturing Semiconductor Device, And Wire Bonder App 20100203681 - MISUMI; KAZUYUKI ;   et al. | 2010-08-12 |
Resin molded semiconductor device and differential amplifier circuit Grant 7,763,966 - Misumi , et al. July 27, 2 | 2010-07-27 |
Semiconductor Device And Method Of Manufacturing Same App 20100164077 - Bando; Koji ;   et al. | 2010-07-01 |
Method For Manufacturing Magnetic Memory Chip Device App 20100120176 - Misumi; Kazuyuki ;   et al. | 2010-05-13 |
Semiconductor Device And Manufacturing Method Therefor App 20100001386 - Misumi; Kazuyuki ;   et al. | 2010-01-07 |
Semiconductor Device App 20090085179 - Misumi; Kazuyuki ;   et al. | 2009-04-02 |
Semiconductor device App 20080217750 - Misumi; Kazuyuki ;   et al. | 2008-09-11 |
Semiconductor device Grant 7,151,316 - Misumi December 19, 2 | 2006-12-19 |
Semiconductor device App 20050006764 - Misumi, Kazuyuki | 2005-01-13 |
Semiconductor device Grant 6,841,870 - Misumi January 11, 2 | 2005-01-11 |
Sealed semiconductor device and lead frame used for the same Grant 6,737,733 - Misumi , et al. May 18, 2 | 2004-05-18 |
Semiconductor device App 20040016999 - Misumi, Kazuyuki | 2004-01-29 |
Lead frame with raised leads and plastic packaged semiconductor device using the same Grant 6,614,101 - Misumi , et al. September 2, 2 | 2003-09-02 |
Resin-encapsulated semiconductor device Grant 6,552,418 - Misumi , et al. April 22, 2 | 2003-04-22 |
Lead Frame With Raised Leads And Plastic Packaged Semiconductor Device Using The Same App 20020105060 - Misumi, Kazuyuki ;   et al. | 2002-08-08 |
Sealed semiconductor device and lead frame used for the same App 20020070431 - Misumi, Kazuyuki ;   et al. | 2002-06-13 |
Resin-encapsulated semiconductor device App 20020030251 - Misumi, Kazuyuki ;   et al. | 2002-03-14 |
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