Mishiro; Kinuko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Mishiro; Kinuko.The latest application filed is for "substrate on which electronic component is soldered, electronic device, method for soldering electronic component".

Company Profile

1.4.6

Mishiro; Kinuko - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate on which electronic component is soldered, electronic device, method for soldering electronic component Grant 10,299,387 - Hirano , et al.	2019-05-21
Substrate On Which Electronic Component Is Soldered, Electronic Device, Method For Soldering Electronic Component App 20180343748 - Hirano; Yoshikazu ; et al.	2018-11-29
Printed Circuit Board And Soldering Method App 20160254241 - MAENO; Yoshinobu ; et al.	2016-09-01
Method For Connection Of Flexible Circuit Boards To Rigid Circuit Board, Device For Connection Thereof, Printed Circuit Board Assembly, And Electronic Apparatus App 20110188214 - MISHIRO; Kinuko	2011-08-04
Method of making assembly module and board module and electronic apparatus Grant 7,835,159 - Mishiro , et al. November 16, 2	2010-11-16
Method of making assembly module and board module and electronic apparatus App 20080101048 - Mishiro; Kinuko ; et al.	2008-05-01
Component mounting substrate and structure Grant 7,321,099 - Mishiro January 22, 2	2008-01-22
Structure and method for reducing warp of substrate App 20070063324 - Mishiro; Kinuko ; et al.	2007-03-22
Component mounting substrate and structure App 20050224252 - Mishiro, Kinuko	2005-10-13
Method of manufacturing a connecting structure of printed wiring boards Grant 5,799,392 - Mishiro September 1, 1	1998-09-01

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