loadpatents
Patent applications and USPTO patent grants for Mirpuri; Kabirkumar.The latest application filed is for "solder attach apparatus and method".
Patent | Date |
---|---|
Separation method, computer storage medium, and separation system Grant 10,008,419 - Okada , et al. June 26, 2 | 2018-06-26 |
Solder-on-die using water-soluble resist system and method Grant 9,659,889 - Oka , et al. May 23, 2 | 2017-05-23 |
Solder Attach Apparatus And Method App 20160240506 - Mirpuri; Kabirkumar | 2016-08-18 |
Solder attach apparatus and method Grant 9,324,680 - Mirpuri April 26, 2 | 2016-04-26 |
Solder-on-die Using Water-soluble Resist System And Method App 20150179595 - Oka; Mihir ;   et al. | 2015-06-25 |
Solder Attach Apparatus And Method App 20150077962 - Mirpuri; Kabirkumar | 2015-03-19 |
Systems And Methods For Avoiding Protrusions In Injection Molded Solder App 20150001706 - Mirpuri; Kabirkumar ;   et al. | 2015-01-01 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.